EP4SGX360KF40C2 vs EP4SGX360KF40I4N 비교
다음의 상세 나란히 비교: EP4SGX360KF40C2 제조: Intel 및 EP4SGX360KF40I4N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP4SGX360KF40C2 | EP4SGX360KF40I4N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $10,400.00 | $3,100.00 |
| Family | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | [DATA_NEEDED: number of DSP blocks and 18x18 multiplier count] |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | — |
| 동작 온도 | 0C to +85C (commercial) | — |
| 패키지 | 1517-ball FCBGA, 42.5 x 42.5 mm | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| 실장 유형 | Surface Mount (flip-chip BGA) | Surface Mount |
| MSL 레벨 | MSL3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL moisture sensitivity level] |
| RoHS 상태 | Compliant | Compliant |
| Logic Elements | — | 353600 |
| Adaptive Logic Modules (ALMs) | — | 141440 |
| LABs/CLBs | — | 14144 |
| Number of I/O | — | 744 |
| Embedded Memory Bits | — | 23105536 |
| Package Pin/Ball Count | — | 1517 |
| Operating Temperature Grade | — | Industrial (I4 suffix) |
| Lead Free | — | Yes |
| Transceivers | — | [DATA_NEEDED: number of embedded transceivers and max data rate] |