EP4SGX360KF40I3N vs EP4SGX360KF43C2N Comparación
Comparación detallada lado a lado de EP4SGX360KF40I3N por Intel y EP4SGX360KF43C2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP4SGX360KF40I3N - Stratix IV GX FPGA, 360K LEs, 1517-FBGA | Intel
EP4SGX360KF40I3N ⚠ Última compra
Comparación de especificaciones
| Parámetro | EP4SGX360KF40I3N | EP4SGX360KF43C2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5.120,00 | $1.975,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 14,144 |
| Logic Array Blocks (LABs) | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 |
| User I/O Pins | 744 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Encapsulado | 1517-BGA, FC-FBGA | 1760-ball FC-FBGA (KF43) |
| Tipo de montaje | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Temperatura de funcionamiento | -40C to +100C (Industrial, I3 grade) | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel | — |
| Hard IP Blocks | PCIe Gen1/Gen2, External Memory Controllers | — |
| Series | — | Stratix IV |
| Logic Elements (LE) | — | 353,600 |
| Logic Cells | — | 353,600 |
| User I/O Count | — | 880 |
| Core Voltage (Vcc) | — | 0.9 V |
| Process Node | — | 40 nm |
| Speed Grade | — | C2 |
| Temperature Grade | — | Industrial |
| Nivel MSL | — | 3 (per JEDEC J-STD-020, 168 hours) |