EP4SGX360KF40I3N - Stratix IV GX FPGA, 360K LEs, 1517-FBGA | Intel
N.º de pieza: EP4SGX360KF40I3N ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6545.98 | $6.545,98 |
| 10 | $6190.5 | $61.905,00 |
| 50 | $5820 | $291.000,00 |
| 100 | $5490 | $549.000,00 |
| 250 | $5120 | $1.280.000,00 |
EP4SGX360KF40I3N Descripción general
An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration bitstreams rather than at the factory. FPGAs sit between fixed-function ASICs and software-defined processors in the design hierarchy, offering hardware-timed parallelism, sub-nanosecond latency, and the ability to integrate multi-gigabit transceivers, memory controllers, and DSP blocks on a single die. The Stratix IV GX family specifically adds embedded transceivers up to 8.5 Gbps, distinguishing it from logic-only or memory-optimized predecessors.
Key features include 48 full-duplex transceiver channels supporting common serial protocols, dedicated hard IP for PCI Express Gen1/Gen2, 8-input adaptive logic modules (ALMs), and on-chip memory with optional ECC. The 1517-FCBGA package exposes 744 general-purpose I/Os distributed across 16 banks, allowing flexible mixed-voltage interfacing (1.2 V to 3.3 V). Eight phase-locked loops (PLLs) provide robust clock management across multiple frequency domains, critical for protocol bridging and source-synchronous memory interfaces.
Architecture highlights include the ALM (Adaptive Logic Module) which combines the capabilities of LUT-based logic with dedicated arithmetic paths, and the MLAB (Memory Logic Array Block) which can operate as either distributed SRAM or as additional logic. Hard IP blocks for transceivers, PCIe, and external memory controllers free up logic resources and reduce latency compared to soft implementations. Power is managed via the PowerPlay toolkit with fine-grained quiescent power gating.
Typical applications include 40G/100G line card packet processing, OTN/SONET framer designs, ASIC and DSP prototyping, high-frequency trading accelerators, and broadcast video processing. The integrated transceivers and high logic density make it well suited for protocol bridging and high-throughput data aggregation where deterministic latency is required.
When designing with this device, pay close attention to PCB escape routing for the 1517-ball FCBGA; high-speed transceiver channels require impedance-controlled differential pairs and length matching. Plan power sequencing across multiple supply rails (0.9 V core, 1.1 V transceiver, 1.8 V/2.5 V/3.3 V I/O) and consult the Stratix IV GX Handbook for transceiver channel placement rules. Configuration via JTAG or fast passive parallel mode is required at every power-up.
This page synthesizes Intel distributor pricing, verified drop-in alternatives from the same Stratix IV GX family, and engineering design notes that go beyond what the manufacturer datasheet alone provides.
Alternativas directas para EP4SGX360KF40I3N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP4SGX360KF40I3N (mismo factor de forma y huella) — difiere en Package, Speed Grade, Process Technology, Operating Temperature, Embedded Memory.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP4SGX360KF40I3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1925 / unidad
Ver hoja de datos →EP4SGX360KF40C3N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1320 / unidad
Ver hoja de datos →EP4SGX360KF40C4N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3360 / unidad
Ver hoja de datos →EP4SGX360KF40I4N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3100 / unidad
Ver hoja de datos →EP4SGX360KF40C3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$8200 / unidad
Ver hoja de datos →EP4SGX360KF40C2N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1850 / unidad
Ver hoja de datos →EP4SGX360KF40C2
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$10400 / unidad
Ver hoja de datos →EP4SGX360KF40I3N Valores máximos y características eléctricas
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| Embedded Memory (bits) | 23,105,536 |
| User I/O Pins | 744 |
| Transceiver Data Rate | Up to 8.5 Gbps |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Encapsulado | 1517-BGA, FC-FBGA |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (Industrial, I3 grade) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel |
| Hard IP Blocks | PCIe Gen1/Gen2, External Memory Controllers |
Guía de configuración de pines de EP4SGX360KF40I3N 1517-bga, fc-fbga
Configuración de pines para EP4SGX360KF40I3N (encapsulado 1517-bga, fc-fbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP4SGX360KF40I3N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP4SGX360KF40I3N es adecuado para 6 aplicacións: 40G/100G Telecom Line Card Packet Processing, ASIC and DSP Prototyping, High-Frequency Trading Accelerators, Broadcast Video Processing and Format Conversion, Industrial Control and Automation Backplanes, Medical Imaging Front-End Processing.
40G/100G Telecom Line Card Packet Processing
The EP4SGX360KF40I3N is well suited to 40G and 100G line card designs because it combines 353,600 logic elements with embedded transceivers up to 8.5 Gbps. Multiple transceiver channels can be aggregated to feed OTN framer, packet parser, and traffic manager blocks, while the abundant on-chip memory (23 Mbits) provides deep packet buffers. Compared with ASIC-only predecessors, this FPGA cuts development time from years to months while still hitting line-rate forwarding performance.
Recomendado
ASIC and DSP Prototyping
Designers use the EP4SGX360KF40I3N for ASIC and DSP prototyping because its 353,600 logic elements and abundant memory can hold multi-million-gate ASIC designs at full speed. The industrial temperature grade enables bring-up in harsh lab and field environments. Designers also benefit from Quartus II synthesis, simulation, and debug flows plus logic analyzer and SignalTap II integration, reducing prototype-to-silicon iteration time.
Recomendado
High-Frequency Trading Accelerators
In high-frequency trading systems the EP4SGX360KF40I3N is used to accelerate order-book matching, market-data fan-out, and risk checks where sub-microsecond latency is critical. The dedicated transceivers deliver market data into the FPGA at 10 Gbps line rate, while the parallel ALM fabric executes custom match engines in fewer clock cycles than a CPU. The industrial temperature grade and high logic density make it a strong fit for colocation rack-mounted trading appliances.
Recomendado
Broadcast Video Processing and Format Conversion
Broadcast studios deploy the EP4SGX360KF40I3N for SD/HD/3G-SDI routing, frame-rate conversion, color-space transformation, and HDR/SDR mapping. Its parallel processing fabric handles real-time multi-stream video at very low latency, while 8.5 Gbps transceivers support 3G-SDI and emerging 12G-SDI over coaxial cable. Industrial temperature operation also enables outdoor broadcast trucks and stadium installs.
Recomendado
Industrial Control and Automation Backplanes
The EP4SGX360KF40I3N is used as a backplane controller in factory automation and process control systems. Its 744 user I/O pins aggregate fieldbus signals (PROFIBUS, EtherCAT, RS-485) plus Ethernet, while the industrial temperature grade handles harsh factory environments. The embedded transceivers support SFP-based gigabit uplinks and deterministic low-latency control loops required for servo drives and robotic controllers.
Recomendado
Medical Imaging Front-End Processing
In ultrasound, CT, and MRI systems the EP4SGX360KF40I3N performs beamforming, channel equalization, and image reconstruction in real time. Its abundant DSP blocks and on-chip memory deliver the multiply-accumulate throughput needed for parallel image reconstruction algorithms. The industrial temperature grade supports continuous operation in controlled but thermally loaded equipment rooms, while the high I/O count aggregates many analog front-end channels.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP4SGX360KF40I3N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP4SGX360KF40I3 | EP4SGX360KF40C3N | EP4SGX360KF40C4N | EP4SGX360KF40I4N | EP4SGX360KF40C3 |
|---|---|---|---|---|---|---|
| Package | 1517-FCBGA (KF40) | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same | 1517-FCBGA (KF40) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Logic Array Blocks (LABs) | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/O Pins | 744 | 744 | 744 | 744 | 744 | 744 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -3 | -3 | -3 | -4 (faster) | -4 (faster) | -3 |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
Diferenciadores clave
- Highest-density Stratix IV GX variant in KF40 package (frente a EP4SGX230KF40I3N)
- Largest user I/O count in Stratix IV GX family (frente a EP4SGX360HF35I3N)
- Hard IP for PCIe and external memory controllers (frente a EP4CGX150DF31I7N)
Notas de diseño
The 1517-ball FC-FBGA package requires high-density PCB technology: microvia (laser-drilled or stacked), 1 oz copper on outer layers, and tight trace-and-space rules (typically 4 mil/4 mil or finer). Escape routing on the top layer is essentially impossible; plan a 1-2-1 or 1-2-2-1 stackup with via-in-pad if BGA breakout density is critical. Use the Stratix IV GX Pin-Out File to identify high-speed transceiver ball locations and route differential pairs first, with intra-pair skew target below 5 mil.
Provide independent decoupling for each power rail: 0.9 V core, 1.1 V transceiver analog (XCVR_VCC), 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V I/O banks, and the 2.5 V/3.0 V PLL analog supply. Place 0.1 uF X7R ceramic decoupling capacitors on every power pin pair as close to the BGA ball as possible, supplemented by bulk 10-47 uF tantalum or polymer capacitors near the package edges. Use PowerPlay early-power estimator in Quartus II to size your VRMs.
Do not mix the EP4SGX360KF40I3N with the EP4SGX360HF35I3N on the same PCB footprint - the HF35 1152-ball package has a different ball map. Also, verify that you have selected the correct Quartus II device library and pin assignments before generating the SOF/POF programming file, as some pin names differ between speed grades. Configuration mode (AS, PS, FPP, JTAG) is set by MSEL pins - do not leave them floating.
Información de cumplimiento
RoHS and lead-free compliance confirmed by Intel product datasheet and Bettlink/Besenchips listings. Halogen-free and conflict-mineral status not explicitly stated in the provided data.
