EP4SGX360KF43C2N vs EP4SGX360HF35C2N Comparación
Comparación detallada lado a lado de EP4SGX360KF43C2N por Intel y EP4SGX360HF35C2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360KF43C2N | EP4SGX360HF35C2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.975,00 | $3.295,00 |
| Family | Stratix IV GX | FPGA - Field Programmable Gate Array |
| Series | Stratix IV | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALMs) | 14,144 | — |
| Logic Cells | 353,600 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| User I/O Count | 880 | — |
| Core Voltage (Vcc) | 0.9 V | — |
| Process Node | 40 nm | — |
| Speed Grade | C2 | 35 (HF35) |
| Encapsulado | 1760-ball FC-FBGA (KF43) | 1152-BBGA, FCBGA (HF35) |
| Temperature Grade | Industrial | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Nivel MSL | 3 (per JEDEC J-STD-020, 168 hours) | — |
| Number of Logic Elements/Cells | — | 353,600 |
| Number of LABs/CLBs | — | 14,144 |
| Number of I/O | — | 564 |
| Total RAM Bits | — | 23,105,536 |
| Process Technology | — | 40 nm CMOS |
| Core Voltage | — | 0.9 V |
| DSP Performance | — | 800 MHz |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Lead Free | — | Yes |
| Power/Temperature Grade | — | C2 |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| DSP Blocks | — | Yes (variable-precision) |