EP4SGX530NF45C2NES vs EP4SGX530NF45C3G Comparación
Comparación detallada lado a lado de EP4SGX530NF45C2NES por Intel y EP4SGX530NF45C3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP4SGX530NF45C2NES - Stratix IV GX FPGA, 531K LE, 1932-FBGA | Intel
EP4SGX530NF45C2NES ⚠ Última compraComparación de especificaciones
| Parámetro | EP4SGX530NF45C2NES | EP4SGX530NF45C3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.950,00 | $3.655,00 |
| Family | Stratix IV GX | — |
| Logic Elements | 531,200 | 531,200 |
| Adaptive Logic Modules (CLBs) | 21,248 | — |
| Embedded Memory | 28,033,024 bits (approx. 27.2 Mbit / 3,423 Kbit per M9K block) | 27,840 Kbits |
| Maximum User I/O | 920 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | Multi-gigabit transceivers (up to 12.5 Gbps) | — |
| Core Voltage VCC | 0.87 V to 0.93 V | — |
| Maximum Core Frequency | 800 MHz | — |
| Process Technology | 40 nm | — |
| Encapsulado | 1932-ball FBGA (FCBGA), 45 mm x 45 mm | 1932-ball FCBGA |
| JEDEC Package Code | S-PBGA-B | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (LEAD FREE per datasheet) | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Hard IP Blocks | PCI Express, Memory Controllers, DSP blocks | — |
| Estado del ciclo de vida | Last Time Buy (per Stratix IV family status) | — |
| Series | — | Stratix IV GX |
| Manufacturer | — | Intel (formerly Altera) |
| Embedded Multipliers (18x18) | — | 1,024 |
| User I/O Pins | — | 920 |
| Transceiver Count | — | 24 |
| Max Transceiver Data Rate | — | 8.5 Gbps |
| PCI Express Hard IP Blocks | — | 8 |
| Speed Grade | — | C3 (commercial) |
| Process Node | — | 40 nm |
| Temperatura de unión de funcionamiento | — | 0C to +85C (commercial) |
| Estado RoHS | — | Compliant |