EPF10K100BQC240-3 vs EPF10K100EBC356-1X Comparación
Comparación detallada lado a lado de EPF10K100BQC240-3 por Altera y EPF10K100EBC356-1X por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EPF10K100BQC240-3 - 100K Gate FLEX-10K FPGA, 240-PQFP | Intel / Altera
EPF10K100BQC240-3 Nrnd
Comparación de especificaciones
| Parámetro | EPF10K100BQC240-3 | EPF10K100EBC356-1X |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16,95 | $165,00 |
| Family | FLEX-10K | — |
| Series | FLEX-10K® | FLEX 10KE |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Typical Gate Count | 100,000 gates | — |
| Logic Elements / Cells | 4,992 | — |
| Total RAM Bits | 6,144 | 49,152 |
| Maximum Frequency | 200 MHz | — |
| Speed Grade | -3 | -1X |
| Process Technology | 0.22 µm CMOS | — |
| Tensión de alimentación | 4.75 V to 5.25 V | — |
| Supplier Device Package | 240-PQFP (32 x 32 mm) | — |
| Encapsulado / Carcasa | 240-BFQFP (PQFP-240) | — |
| Pin Pitch | 0.50 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Propagation Delay | 14.5 ns | 0.6 ns |
| Configuration Memory | External SRAM (e.g., EPC1 / EPC2) | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | 0 C to +70 C (Commercial) |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 4,992 |
| Typical Gates | — | 100,000 |
| Logic Array Blocks (LABs) | — | 624 |
| Embedded Array Blocks (EABs) | — | 12 |
| User I/O Count | — | 274 |
| Logic Family | — | CMOS |
| Core Process Technology | — | 0.22 um CMOS, 5 metal layers |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V (multi-volt tolerant to 5 V) |
| Package Type | — | 356-LBGA (BGA-356) |
| Package Dimensions | — | 35 x 35 mm, 1.27 mm ball pitch |
| Configuration Method | — | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |