EPF10K100BQC240-3 vs EPF10K100EBC356-1X Comparaison
Comparaison détaillée côte à côte de EPF10K100BQC240-3 par Altera et EPF10K100EBC356-1X par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Altera
EPF10K100BQC240-3 - 100K Gate FLEX-10K FPGA, 240-PQFP | Intel / Altera
EPF10K100BQC240-3 Nrnd
Comparaison des spécifications
| Paramètre | EPF10K100BQC240-3 | EPF10K100EBC356-1X |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $16,95 | $165,00 |
| Family | FLEX-10K | — |
| Series | FLEX-10K® | FLEX 10KE |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Typical Gate Count | 100,000 gates | — |
| Logic Elements / Cells | 4,992 | — |
| Total RAM Bits | 6,144 | 49,152 |
| Maximum Frequency | 200 MHz | — |
| Speed Grade | -3 | -1X |
| Process Technology | 0.22 µm CMOS | — |
| Tension d'alimentation | 4.75 V to 5.25 V | — |
| Supplier Device Package | 240-PQFP (32 x 32 mm) | — |
| Boîtier / Format | 240-BFQFP (PQFP-240) | — |
| Pin Pitch | 0.50 mm | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Propagation Delay | 14.5 ns | 0.6 ns |
| Configuration Memory | External SRAM (e.g., EPC1 / EPC2) | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | 0 C to +70 C (Commercial) |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 4,992 |
| Typical Gates | — | 100,000 |
| Logic Array Blocks (LABs) | — | 624 |
| Embedded Array Blocks (EABs) | — | 12 |
| User I/O Count | — | 274 |
| Logic Family | — | CMOS |
| Core Process Technology | — | 0.22 um CMOS, 5 metal layers |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V (multi-volt tolerant to 5 V) |
| Package Type | — | 356-LBGA (BGA-356) |
| Package Dimensions | — | 35 x 35 mm, 1.27 mm ball pitch |
| Configuration Method | — | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |