EPF10K100EQC240-1X vs EPF10K100BQC240-1 Comparación
Comparación detallada lado a lado de EPF10K100EQC240-1X por Intel y EPF10K100BQC240-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K100BQC240-1 - 100K FLEX-10K FPGA, 240-PQFP | Intel / Altera
EPF10K100BQC240-1 ⚠ Última compraComparación de especificaciones
| Parámetro | EPF10K100EQC240-1X | EPF10K100BQC240-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $65,00 | $119,00 |
| Series | FLEX 10KE | FLEX-10K |
| Family | FLEX 10KE Field Programmable Gate Array | FLEX-10K (EPF10K100B) |
| System Gates | 100,000 | — |
| Logic Cells | 4,992 | — |
| Logic Array Blocks (LABs) | 624 | — |
| Total RAM Bits | 49,152 | 24,576 (12 × 2,048 bits per EAB) |
| User I/Os | 189 | — |
| Core Voltage | 2.375 V to 2.625 V (typ. 2.5 V) | — |
| Maximum Internal Clock Frequency | 333.33 MHz | — |
| Process Technology | 0.22 um CMOS | 0.42 µm SRAM CMOS |
| Encapsulado | 240-BFQFP / PQFP, 32 x 32 mm | 240-pin BFQFP / PQFP (BQC suffix) |
| Tipo de montaje | Surface Mount, gull-wing leads | Surface Mount |
| Packaging | Tray | — |
| Nivel de sensibilidad a la humedad (MSL) | 3 (168 Hours) | — |
| Peak Reflow Temperature (Max) | 30 s [DATA_NEEDED: peak temperature deg C] | — |
| JTAG Compliance | IEEE Std. 1149.1-1990 BST | — |
| PCI Compliance | PCI Local Bus Specification Revision 2.2 (3.3 V and 5.0 V operation, -1 speed grade) | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance] |
| Logic Elements (LEs) | — | 6,144 |
| Typical Gates | — | 100,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Maximum User I/O | — | 189 |
| Supply Voltage (VCCINT / VCCIO) | — | 4.75 V to 5.25 V |
| Speed Grade | — | -1 |
| Combinatorial tPD (typical) | — | 11 ns |
| Package Dimensions | — | 32 mm × 32 mm |
| Temperatura de funcionamiento | — | 0 °C to +70 °C (commercial) |
| Configuration Method | — | ByteBlasterMV / BitBlaster / JTAG |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |