EPF10K100EQC240-1X vs EPF10K100BQC240-1 Comparaison
Comparaison détaillée côte à côte de EPF10K100EQC240-1X par Intel et EPF10K100BQC240-1 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K100BQC240-1 - 100K FLEX-10K FPGA, 240-PQFP | Intel / Altera
EPF10K100BQC240-1 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EPF10K100EQC240-1X | EPF10K100BQC240-1 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $65,00 | $119,00 |
| Series | FLEX 10KE | FLEX-10K |
| Family | FLEX 10KE Field Programmable Gate Array | FLEX-10K (EPF10K100B) |
| System Gates | 100,000 | — |
| Logic Cells | 4,992 | — |
| Logic Array Blocks (LABs) | 624 | — |
| Total RAM Bits | 49,152 | 24,576 (12 × 2,048 bits per EAB) |
| User I/Os | 189 | — |
| Core Voltage | 2.375 V to 2.625 V (typ. 2.5 V) | — |
| Maximum Internal Clock Frequency | 333.33 MHz | — |
| Process Technology | 0.22 um CMOS | 0.42 µm SRAM CMOS |
| Boîtier | 240-BFQFP / PQFP, 32 x 32 mm | 240-pin BFQFP / PQFP (BQC suffix) |
| Type de montage | Surface Mount, gull-wing leads | Surface Mount |
| Packaging | Tray | — |
| Niveau de sensibilité à l'humidité (MSL) | 3 (168 Hours) | — |
| Peak Reflow Temperature (Max) | 30 s [DATA_NEEDED: peak temperature deg C] | — |
| JTAG Compliance | IEEE Std. 1149.1-1990 BST | — |
| PCI Compliance | PCI Local Bus Specification Revision 2.2 (3.3 V and 5.0 V operation, -1 speed grade) | — |
| Statut RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance] |
| Logic Elements (LEs) | — | 6,144 |
| Typical Gates | — | 100,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Maximum User I/O | — | 189 |
| Supply Voltage (VCCINT / VCCIO) | — | 4.75 V to 5.25 V |
| Speed Grade | — | -1 |
| Combinatorial tPD (typical) | — | 11 ns |
| Package Dimensions | — | 32 mm × 32 mm |
| Température de fonctionnement | — | 0 °C to +70 °C (commercial) |
| Configuration Method | — | ByteBlasterMV / BitBlaster / JTAG |
| Niveau MSL | — | 3 (per JEDEC J-STD-020) |