EPF10K130EFC484-1 vs EPF10K130EFC484-3N Comparación
Comparación detallada lado a lado de EPF10K130EFC484-1 por Intel y EPF10K130EFC484-3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K130EFC484-1 - FLEX-10KE FPGA 130K Gates 484-BGA | Intel / Altera
EPF10K130EFC484-1 ✓ Activo
Comparación de especificaciones
| Parámetro | EPF10K130EFC484-1 | EPF10K130EFC484-3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $92,00 | $109,25 |
| Series | FLEX-10KE | FLEX-10KE |
| Family | FLEX-10KE | — |
| Typical Gates | 130,000 | — |
| Logic Elements | 6,656 | — |
| Logic Array Blocks (LABs) | 832 | — |
| Embedded Memory (EAB) | 65,536 bits (64 Kbit) | — |
| User I/Os | 369 | — |
| Maximum Frequency | 333.33 MHz | — |
| Propagation Delay | 0.6 ns | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 3.3 V (MultiVolt I/O compatible with 5.0 V tolerant) | — |
| Logic Family | CMOS | — |
| Package Type | FineLine BGA-484 | 484-BBGA (FineLine BGA) |
| Package Dimensions | 23 x 23 mm | 23 x 23 mm |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Temperatura de funcionamiento | 0C to +70C (Commercial) | — |
| Configuration Interface | JTAG (IEEE 1149.1 / IEEE 1532) | JTAG / PS / PPS / Altera serial |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Speed Grade | -1 (slower commercial bin) | -3 (faster timing bin) |
| Number of Logic Elements / Cells | — | 6656 |
| Total RAM Bits | — | 65536 |
| Typical Gate Count | — | 130000 |
| Number of I/O | — | 369 |
| Number of LABs/CLBs | — | 832 |
| Number of Embedded Array Blocks (EABs) | — | 72 |
| Operating Temperature Grade | — | Commercial (0C to +70C) |
| Core Voltage | — | 2.5 V |
| Process Technology | — | 0.22 µm CMOS |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |