EPF10K130EFC672-1X vs EPF10K130EFC672-2 Comparación
Comparación detallada lado a lado de EPF10K130EFC672-1X por Intel y EPF10K130EFC672-2 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K130EFC672-1X | EPF10K130EFC672-2 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $342,75 | $61,75 |
| Family | FLEX 10KE | FLEX 10KE |
| Series | FLEX 10KE® | — |
| Typical Gates | 130,000 | — |
| Logic Elements (LEs) | 6,656 | — |
| Total RAM Bits | 65,536 | — |
| Logic Array Blocks (LABs) | 832 | 832 |
| User I/Os | 413 | — |
| Number of I/O Banks | 8 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Internal Operating Frequency | up to 333.33 MHz | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.22 µm CMOS |
| Encapsulado | 672-ball FBGA, 27x27 mm, 1.0 mm pitch | 672-ball FineLine BGA |
| Speed Grade | -1X | -2 |
| Operating Temperature (Commercial) | 0 °C to +70 °C | — |
| Configuration Mode | Passive Serial, JTAG, ByteBlaster | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Moisture Sensitivity Level | MSL 3 (per JEDEC J-STD-020) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements / Cells | — | 6,656 |
| Total Gates | — | ~130,000 |
| Embedded Memory (RAM bits) | — | 65,536 |
| Maximum User I/Os | — | 413 |
| Number of I/O Pins | — | 672 (package pins) |
| Core Supply Voltage | — | 2.5 V |
| Propagation Delay (typ.) | — | 0.6 ns |
| Internal Operating Frequency (max) | — | 333.33 MHz |
| Temperatura de funcionamiento | — | 0 °C to +70 °C (Commercial) |
| Programming Method | — | SRAM-based, JTAG (IEEE 1149.1) |