EPF10K130EFC672-2 - 130K Gates FLEX 10KE FPGA | Altera | 672-BGA
N.º de pieza: EPF10K130EFC672-2 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $85.5 | $855,00 |
| 100 | $76 | $7.600,00 |
| 500 | $68.4 | $34.200,00 |
| 1.000 | $61.75 | $61.750,00 |
EPF10K130EFC672-2 Descripción general
An FPGA (Field-Programmable Gate Array) is a programmable logic device belonging to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the integrated-circuit taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit. The FLEX 10KE family combines a fine-grained Look-Up Table (LUT)-based logic array with an embedded array block (EAB) that can be configured as memory, multipliers, or specialized logic, allowing a single chip to replace dozens of discrete 74-series logic parts.
Key features include 832 Logic Array Blocks (LABs), 413 maximum user I/Os, 65,536 RAM bits, dedicated carry and cascade chains for fast arithmetic, and built-in JTAG (IEEE 1149.1) boundary-scan support. The 672-ball FineLine BGA package exposes a large number of general-purpose I/Os that are 5 V-tolerant on input, simplifying interfacing with legacy TTL/CMOS peripherals without external level shifters. Operating temperature range is 0 °C to +70 °C (commercial grade), with the speed grade -2 placing the device in a balanced performance tier of the family.
Typical applications include high-density glue logic, telecommunications backplane interfaces, ASIC prototyping, image and video pre-processing pipelines, industrial control boards, and legacy system upgrades that require large numbers of I/O channels and configurable logic. The EPF10K130EFC672-2 is widely deployed in long-lifecycle industrial and defense systems where the proven FLEX 10KE tool flow (Quartus II or MAX+PLUS II) remains in active use.
When designing with this device, pay close attention to power-rail decoupling: each VCCINT and VCCIO bank should have its own 0.1 µF and 10 µF ceramic capacitor pair placed within 5 mm of the BGA balls. The 672-pin BGA package requires careful PCB stack-up planning to fan out all signals without exceeding manufacturability limits on via-in-pad and microvia density.
This page synthesizes distributor stock data, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet to support engineers maintaining FLEX 10KE designs.
Alternativas directas para EPF10K130EFC672-2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPF10K130EFC672-2 (mismo factor de forma y huella) — difiere en Package, Process Technology, Operating Temperature, Speed Grade, Core Supply Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPF10K130EFC672-3
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EPF10K130EFC672-1X
✅ Sustitución directa✓ En stock
$342.75 / unidad
Ver hoja de datos →EPF10K130EFC672-2X
✅ Sustitución directa✓ En stock
$92 / unidad
Ver hoja de datos →EPF10K130EFI672-2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EPF10K200EFC672-2
✅ Sustitución directa✓ En stock
$210 / unidad
Ver hoja de datos →EPF10K130EFC672-2 Valores máximos y características eléctricas
| Family | FLEX 10KE |
| Logic Elements / Cells | 6,656 |
| Total Gates | ~130,000 |
| Logic Array Blocks (LABs) | 832 |
| Embedded Memory (RAM bits) | 65,536 |
| Maximum User I/Os | 413 |
| Number of I/O Pins | 672 (package pins) |
| Encapsulado | 672-ball FineLine BGA |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Propagation Delay (typ.) | 0.6 ns |
| Internal Operating Frequency (max) | 333.33 MHz |
| Temperatura de funcionamiento | 0 °C to +70 °C (Commercial) |
| Speed Grade | -2 |
| Programming Method | SRAM-based, JTAG (IEEE 1149.1) |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de EPF10K130EFC672-2 672-ball fineline bga
Configuración de pines para EPF10K130EFC672-2 (encapsulado 672-ball fineline bga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPF10K130EFC672-2.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPF10K130EFC672-2 es adecuado para 6 aplicacións: Telecommunications Backplane Interface, ASIC Prototyping Platform, Industrial Control and Machine Vision Pre-Processing, Legacy Defense and Avionics Upgrades, High-Density Glue Logic Replacement, Test and Measurement Instrumentation Backplane.
Telecommunications Backplane Interface
The EPF10K130EFC672-2 is well suited to legacy telecom backplane designs that require large numbers of I/O channels and configurable glue logic. With 413 user I/Os in a 672-BGA package, the FPGA can directly interface 8-bit or 16-bit parallel buses on multiple cards without external transceivers. Its 0.22 µm CMOS process and 2.5 V core provide low static power suitable for always-on central-office equipment, while the 333.33 MHz internal operating frequency comfortably handles TDM and LVDS signalling up to 155 Mbps. Compared to a discrete 74-series TTL implementation, this single FPGA replaces dozens of packages and shortens time-to-market for new line-card variants.
Recomendado
ASIC Prototyping Platform
Engineers use the EPF10K130EFC672-2 as an ASIC prototype vehicle for mid-complexity ASICs because of its 130K-gate capacity and embedded array blocks (EABs) that can implement dual-port RAM, FIFO, and small multipliers. The JTAG-supported SRAM programming model lets designers iterate logic quickly between simulations and real silicon. The 672-BGA package exposes enough user I/O to mimic 200+ signal ASIC pads, which covers most mid-range gate-array designs. Quartus II synthesis delivers repeatable timing closure across prototype and pilot runs.
Recomendado
Industrial Control and Machine Vision Pre-Processing
The 6,656 logic elements and 65,536 embedded RAM bits make the EPF10K130EFC672-2 effective for line-scan camera pre-processing, where pixel data must be buffered in dual-port RAM and reduced through a pipeline of histogram and threshold blocks before reaching a host CPU. Its commercial 0 °C to +70 °C temperature range covers most factory-floor enclosures, and the wide 3.3 V I/O tolerance enables direct connection to CMOS image sensors without level shifters. The 413 user I/Os simultaneously carry parallel camera data, encoder feedback, and isolated GPIO to motor drivers in a compact BGA footprint.
Recomendado
Legacy Defense and Avionics Upgrades
Long-lifecycle military platforms depend on the FLEX 10KE family because Altera/Intel continues to support tool flows (MAX+PLUS II, Quartus II) for the EPF10K130EFC672-2 well beyond commercial product life. The SRAM-programmable logic allows field upgrades via JTAG without removing cards, and the 672-BGA package provides sufficient I/O for MIL-STD-1553, ARINC 429, and discrete interfaces. With its 2.5 V core and 0.22 µm process, the device delivers predictable performance for safety-critical signal routing, although it is not AEC-Q100 qualified and is not used in automotive safety applications.
Recomendado
High-Density Glue Logic Replacement
Designers use the EPF10K130EFC672-2 to replace dozens of 74-series TTL, CMOS, and PAL/GAL devices with a single programmable device, shrinking board area and BOM cost. With 832 LABs and built-in carry chains, the device efficiently implements counters, address decoders, bus arbiters, and state machines that previously required multiple discrete packages. The 672-BGA FineLine package supports the high I/O fan-out typical of glue-logic consolidation, and Quartus II synthesis preserves the original 74-series pin naming conventions to simplify porting legacy schematics.
Recomendado
Test and Measurement Instrumentation Backplane
Test equipment such as logic analyzers, protocol exercisers, and ATE fixtures use the EPF10K130EFC672-2 as a flexible pattern-generator and pin-electronics controller. The 413 user I/Os map cleanly onto 32-bit data buses plus control and clock lines, and the 65,536-bit embedded memory serves as on-chip pattern buffer. JTAG programming allows rapid fixture reconfiguration for different device-under-test packages, while the 333.33 MHz internal rate supports pattern rates well into the hundred-MHz range required for high-speed digital test. The 672-BGA package keeps the backplane card compact inside the instrument chassis.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPF10K130EFC672-2 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPF10K130EFC672-3 | EPF10K130EFC672-1 | EPF10K130EFI672-2 | EPF10K200EFC672-2 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 672-Ball FineLine BGA | 672-Ball FineLine BGA - same | 672-Ball FineLine BGA - same | 672-Ball FineLine BGA - same | 672-Ball FineLine BGA - same |
| Logic Elements | 6,656 | 6,656 | 6,656 | 6,656 | 9,984 (approx) |
| Total Gates | ~130,000 | ~130,000 | ~130,000 | ~130,000 | ~200,000 |
| User I/Os | 413 | 413 | 413 | 413 | 375 (approx, due to larger die) |
| Speed Grade | -2 | -3 (faster) | -1 (slower) | -2 | -2 |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
Diferenciadores clave
- Highest I/O count in 672-BGA FLEX 10KE family (frente a EPF10K200EFC672-2)
- Commercial-grade temperature rating at lowest cost (frente a EPF10K130EFI672-2)
- Balanced speed grade -2 for cost-performance ratio (frente a EPF10K130EFC672-3)
Notas de diseño
The FLEX 10KE EPF10K130E requires a clean 2.5 V VCCINT supply capable of delivering 1-2 A under typical operating conditions, plus a separate VCCIO rail configurable to 2.5 V or 3.3 V per I/O bank. Place one 0.1 µF and one 10 µF ceramic capacitor pair within 5 mm of each VCCINT ball cluster, and replicate the same decoupling on every VCCIO ball. The PLL analog supply VCCA must be tied to a quiet 1.5 V rail even if the PLL is unused - leaving it floating causes unstable operation.
The 672-ball FineLine BGA requires at least a 4-layer PCB stack-up with dedicated ground and power planes to fan out all signals on a 1.0 mm pitch. Microvia or via-in-pad technology is recommended for inner rows to break out the BGA. Maintain a continuous ground plane under the device to provide a low-impedance return path for the high-speed JTAG and clock signals, and keep all VCCIO banks routed as planes to minimize IR drop.
Estimated: configuration time after power-on can exceed 100 ms for a fully-utilized 130K-gate design; design reset circuits accordingly. Do not leave any VCCIO bank unconnected - unused banks must still be tied to a valid 2.5 V or 3.3 V rail so input buffers are not floating. JTAG chain integrity must be verified before production - a single open TDI or TMS pin will prevent programming. Finally, always load the correct FLEX 10KE BSDL file into the JTAG boundary-scan tool, because generic BSDL files do not match the 672-BGA variant.
Información de cumplimiento
RoHS and lead-free per Altera/Intel legacy product environmental data. Not AEC-Q100 qualified - automotive safety applications should use a different device. Halogen-free status not stated in available data; conflict-minerals compliance per Altera/Intel statement.