EPF10K130EFC672-2 vs EPF10K200EFC672-2 Comparación
Comparación detallada lado a lado de EPF10K130EFC672-2 por Altera y EPF10K200EFC672-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K130EFC672-2 | EPF10K200EFC672-2 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $61,75 | $210,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 6,656 | — |
| Total Gates | ~130,000 | — |
| Logic Array Blocks (LABs) | 832 | 624 |
| Embedded Memory (RAM bits) | 65,536 | — |
| Maximum User I/Os | 413 | 470 |
| Number of I/O Pins | 672 (package pins) | — |
| Encapsulado | 672-ball FineLine BGA | 672-BBGA (FineLine BGA) |
| Process Technology | 0.22 µm CMOS | 0.22 um CMOS |
| Core Supply Voltage | 2.5 V | — |
| Propagation Delay (typ.) | 0.6 ns | — |
| Internal Operating Frequency (max) | 333.33 MHz | — |
| Temperatura de funcionamiento | 0 °C to +70 °C (Commercial) | 0 C to 70 C |
| Speed Grade | -2 | -2 |
| Programming Method | SRAM-based, JTAG (IEEE 1149.1) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Logic Elements | — | 9,984 |
| Typical Gates | — | 200,000 |
| Embedded Memory | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 12 |
| Package Dimensions | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Propagation Delay | — | 0.4 ns |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Programmability | — | JTAG (IEEE 1149.1) / in-system |
| Estado RoHS | — | Compliant (per distributor listing) |
| Logic Family | — | CMOS |