EPF10K130EQC240-3N vs EPF10K100EQC240-3N Comparación
Comparación detallada lado a lado de EPF10K130EQC240-3N por Intel y EPF10K100EQC240-3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K130EQC240-3N - 130K Gate FLEX-10KE FPGA, 240-PQFP | Intel
EPF10K130EQC240-3N ⚠ Última compra
Comparación de especificaciones
| Parámetro | EPF10K130EQC240-3N | EPF10K100EQC240-3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $19,80 | $49,95 |
| Series | FLEX 10KE | FLEX 10KE |
| Family | FLEX-10KE® | FLEX 10KE (Embedded Programmable Logic Device) |
| Logic Elements | 6,656 | — |
| Logic Array Blocks (LABs) | 832 | 624 |
| Total RAM Bits | 65,536 bits | 49,152 |
| Number of I/O Pins | 186 | — |
| Number of Gates | 342,000 (typical 49,152) | — |
| Maximum Frequency | 200 MHz | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V |
| Temperatura de funcionamiento | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Technology | 0.22 µm CMOS, SRAM-based | — |
| Encapsulado | 240-BQFP (PQFP), 32 x 32 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead Finish | Gull-wing, lead-free (per Altera datasheet) | — |
| Estado RoHS | Compliant | — |
| Configuration Method | SRAM (volatile, requires external PROM) | — |
| PLLs | 4 | — |
| Embedded Multipliers | Yes (EABs configurable as multipliers) | — |
| Supply Voltage I/O | 3.3 V LVTTL/LVCMOS, 5 V tolerant inputs | — |
| Logic Elements / Cells | — | 4,992 |
| Total System Gates | — | 100,000 (typical) |
| Embedded Array Blocks (EABs) | — | 16 |
| Maximum User I/Os | — | 189 |
| Number of PLLs | — | 4 |
| Propagation Delay | — | 0.6 ns |
| Maximum Internal Frequency | — | 200 MHz |
| I/O Supply Voltage | — | 3.3 V (5 V tolerant with PCI clamping) |
| Process Technology | — | 0.22 µm CMOS |
| Package Type | — | 240-pin BFQFP (Power Quad Flat Pack) |
| JTAG Support | — | IEEE Std. 1149.1 boundary-scan |
| Lead-Free / RoHS | — | Pb-free matte tin (N suffix) |
| Configuration Memory Companion | — | EPC2LC20N or compatible |