EPF10K130EQC240-3N vs EPF10K100EQC240-3N Comparaison
Comparaison détaillée côte à côte de EPF10K130EQC240-3N par Intel et EPF10K100EQC240-3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K130EQC240-3N - 130K Gate FLEX-10KE FPGA, 240-PQFP | Intel
EPF10K130EQC240-3N ⚠ Dernier achat
Comparaison des spécifications
| Paramètre | EPF10K130EQC240-3N | EPF10K100EQC240-3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $19,80 | $49,95 |
| Series | FLEX 10KE | FLEX 10KE |
| Family | FLEX-10KE® | FLEX 10KE (Embedded Programmable Logic Device) |
| Logic Elements | 6,656 | — |
| Logic Array Blocks (LABs) | 832 | 624 |
| Total RAM Bits | 65,536 bits | 49,152 |
| Number of I/O Pins | 186 | — |
| Number of Gates | 342,000 (typical 49,152) | — |
| Maximum Frequency | 200 MHz | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V |
| Température de fonctionnement | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Technology | 0.22 µm CMOS, SRAM-based | — |
| Boîtier | 240-BQFP (PQFP), 32 x 32 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Lead Finish | Gull-wing, lead-free (per Altera datasheet) | — |
| Statut RoHS | Compliant | — |
| Configuration Method | SRAM (volatile, requires external PROM) | — |
| PLLs | 4 | — |
| Embedded Multipliers | Yes (EABs configurable as multipliers) | — |
| Supply Voltage I/O | 3.3 V LVTTL/LVCMOS, 5 V tolerant inputs | — |
| Logic Elements / Cells | — | 4,992 |
| Total System Gates | — | 100,000 (typical) |
| Embedded Array Blocks (EABs) | — | 16 |
| Maximum User I/Os | — | 189 |
| Number of PLLs | — | 4 |
| Propagation Delay | — | 0.6 ns |
| Maximum Internal Frequency | — | 200 MHz |
| I/O Supply Voltage | — | 3.3 V (5 V tolerant with PCI clamping) |
| Process Technology | — | 0.22 µm CMOS |
| Package Type | — | 240-pin BFQFP (Power Quad Flat Pack) |
| JTAG Support | — | IEEE Std. 1149.1 boundary-scan |
| Lead-Free / RoHS | — | Pb-free matte tin (N suffix) |
| Configuration Memory Companion | — | EPC2LC20N or compatible |