EPF10K200EBC600-2 vs EPF10K130EBC600-2 Comparación
Comparación detallada lado a lado de EPF10K200EBC600-2 por Intel y EPF10K130EBC600-2 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K200EBC600-2 | EPF10K130EBC600-2 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $455,00 |
| Series | FLEX-10KE | — |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.30 µm CMOS | SRAM CMOS, 0.25 um |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | 832 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | 4 kbit per EAB |
| Maximum User I/O | 470 pins | — |
| Propagation Delay | 0.4 ns | — |
| Tensión de alimentación | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| Temperatura de funcionamiento | 0°C to +70°C (Commercial) | 0 C to +70 C (Commercial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | Serial / Parallel / JTAG |
| Part Status | Obsolete | — |
| Estado RoHS | unknown | Compliant |
| Family | — | FLEX-10KE |
| Typical Gates | — | 130,000 |
| User I/Os | — | 424 |
| Core Voltage (VCCINT) | — | 2.375 V to 2.625 V (2.5 V nominal) |
| I/O Voltage (VCCIO) | — | MultiVolt: 1.8 V / 2.5 V / 3.3 V |
| Speed Grade | — | -2 |
| Pin-to-Pin Delay | — | 0.5 ns |
| Encapsulado | — | 600-BGA (45 x 45 mm) |
| Nivel MSL | — | 3 (168 hours) |
| Supply Current (Quiescent) | — | 10 mA typical |