EPF10K200EBC600-3 vs EPF10K250EBI600-3 Comparación
Comparación detallada lado a lado de EPF10K200EBC600-3 por Intel y EPF10K250EBI600-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoleteIntel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 ⚠ Última compraComparación de especificaciones
| Parámetro | EPF10K200EBC600-3 | EPF10K250EBI600-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $575,00 | $110,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Series | FLEX-10KE | — |
| System Gates | 200,000 | — |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded Memory (EABs) | 24,576 bits | — |
| Maximum User I/O | 470 | 470 |
| Number of PLLs | 4 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] |
| Process Technology | 0.22 micrometer SRAM | 0.22 µm CMOS, 4-layer metal |
| Speed Grade | -3 (commercial) | -3 (fastest) |
| Encapsulado | 600-ball FineLine BGA, 45 x 45 mm | 600-ball BGA (HBGA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0C to +70C (commercial) | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | Not specified (SnPb / tin-lead finish per legacy distributor listing) |
| Logic Elements | — | 12,160 |
| Typical Gate Count | — | 250,000 system gates |
| Embedded System Blocks (ESBs) | — | 12 |
| Dedicated Inputs | — | 4 |
| PLLs | — | 4 |
| On-chip RAM | — | Up to 40 Kbits |
| Ball Pitch | — | 1.93 mm |
| Configuration Method | — | SRAM, requires external configuration device (EPC series) |
| Lead-free | — | no (legacy tin-lead per distributor description) |