EPF10K200EBC600-3 vs EPF10K250EBI600-3 Comparaison
Comparaison détaillée côte à côte de EPF10K200EBC600-3 par Intel et EPF10K250EBI600-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoleteIntel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EPF10K200EBC600-3 | EPF10K250EBI600-3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $575,00 | $110,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Series | FLEX-10KE | — |
| System Gates | 200,000 | — |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded Memory (EABs) | 24,576 bits | — |
| Maximum User I/O | 470 | 470 |
| Number of PLLs | 4 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] |
| Process Technology | 0.22 micrometer SRAM | 0.22 µm CMOS, 4-layer metal |
| Speed Grade | -3 (commercial) | -3 (fastest) |
| Boîtier | 600-ball FineLine BGA, 45 x 45 mm | 600-ball BGA (HBGA) |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | 0C to +70C (commercial) | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | Not specified (SnPb / tin-lead finish per legacy distributor listing) |
| Logic Elements | — | 12,160 |
| Typical Gate Count | — | 250,000 system gates |
| Embedded System Blocks (ESBs) | — | 12 |
| Dedicated Inputs | — | 4 |
| PLLs | — | 4 |
| On-chip RAM | — | Up to 40 Kbits |
| Ball Pitch | — | 1.93 mm |
| Configuration Method | — | SRAM, requires external configuration device (EPC series) |
| Lead-free | — | no (legacy tin-lead per distributor description) |