EPF10K200EBI600-2 vs EPF10K250EBI600-3 Comparación
Comparación detallada lado a lado de EPF10K200EBI600-2 por Intel y EPF10K250EBI600-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteIntel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 ⚠ Última compraComparación de especificaciones
| Parámetro | EPF10K200EBI600-2 | EPF10K250EBI600-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $110,00 |
| Family | FLEX 10KE | FLEX 10KE |
| System Gates | 200,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Embedded RAM | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | — |
| User I/O Pins | 470 | — |
| Supply Voltage (VCCINT) | 2.5 V | — |
| Propagation Delay | 0.4 ns (per -2 speed grade) | — |
| Temperatura de funcionamiento | 0 C to 70 C (commercial) | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] |
| Encapsulado | BGA-600, 45 x 45 mm, 1.27 mm pitch | 600-ball BGA (HBGA) |
| Logic Family | CMOS, SRAM-based | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | SRAM, requires external configuration device (EPC series) |
| Estado RoHS | Compliant (lead-free package) | Not specified (SnPb / tin-lead finish per legacy distributor listing) |
| Logic Elements | — | 12,160 |
| Typical Gate Count | — | 250,000 system gates |
| Embedded System Blocks (ESBs) | — | 12 |
| Maximum User I/O | — | 470 |
| Dedicated Inputs | — | 4 |
| PLLs | — | 4 |
| On-chip RAM | — | Up to 40 Kbits |
| Ball Pitch | — | 1.93 mm |
| Core Voltage | — | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] |
| Speed Grade | — | -3 (fastest) |
| Process Technology | — | 0.22 µm CMOS, 4-layer metal |
| Lead-free | — | no (legacy tin-lead per distributor description) |