EPF10K200EBI600-2 vs EPF10K250EBI600-3 Comparaison
Comparaison détaillée côte à côte de EPF10K200EBI600-2 par Intel et EPF10K250EBI600-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteIntel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EPF10K200EBI600-2 | EPF10K250EBI600-3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $198,00 | $110,00 |
| Family | FLEX 10KE | FLEX 10KE |
| System Gates | 200,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Embedded RAM | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | — |
| User I/O Pins | 470 | — |
| Supply Voltage (VCCINT) | 2.5 V | — |
| Propagation Delay | 0.4 ns (per -2 speed grade) | — |
| Température de fonctionnement | 0 C to 70 C (commercial) | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] |
| Boîtier | BGA-600, 45 x 45 mm, 1.27 mm pitch | 600-ball BGA (HBGA) |
| Logic Family | CMOS, SRAM-based | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | SRAM, requires external configuration device (EPC series) |
| Statut RoHS | Compliant (lead-free package) | Not specified (SnPb / tin-lead finish per legacy distributor listing) |
| Logic Elements | — | 12,160 |
| Typical Gate Count | — | 250,000 system gates |
| Embedded System Blocks (ESBs) | — | 12 |
| Maximum User I/O | — | 470 |
| Dedicated Inputs | — | 4 |
| PLLs | — | 4 |
| On-chip RAM | — | Up to 40 Kbits |
| Ball Pitch | — | 1.93 mm |
| Core Voltage | — | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] |
| Speed Grade | — | -3 (fastest) |
| Process Technology | — | 0.22 µm CMOS, 4-layer metal |
| Lead-free | — | no (legacy tin-lead per distributor description) |