EPF10K200SBC356-1X vs EPF10K200SBC356-2X Comparación
Comparación detallada lado a lado de EPF10K200SBC356-1X por Intel y EPF10K200SBC356-2X por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel
EPF10K200SBC356-1X ⚠ Última compraIntel
EPF10K200SBC356-2X - FLEX 10K 200K Gates FPGA, 274 I/O, 356-BGA | Intel/Altera
EPF10K200SBC356-2X NrndComparación de especificaciones
| Parámetro | EPF10K200SBC356-1X | EPF10K200SBC356-2X |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $138,00 | $295,00 |
| Family | FLEX 10KE | FLEX 10K |
| Series | FLEX-10KS | FLEX-10KS |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 39,616 | — |
| User I/Os | 274 | — |
| Process Technology | 0.22 µm CMOS | CMOS 0.22 µm |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) | — |
| Encapsulado | 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch | 356-LBGA (35x35 mm, 1.27 mm pitch) |
| Operating Temperature Grade | Commercial | — |
| Speed Grade | -1 (fastest commercial bin) | -2 |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| JTAG Support | IEEE Std. 1149.1 boundary scan + ISP | — |
| Lead Free / RoHS | Yes (per -1X suffix) | — |
| Configuration Mode | SRAM-based, ISP via JTAG | — |
| Logic Elements / Cells | — | 9984 |
| Approximate Gate Count | — | 200,000 |
| User I/O Count | — | 274 |
| Tensión de alimentación | — | 2.375 V to 2.625 V (core) |
| Propagation Delay (typ.) | — | 0.4 ns |
| Temperatura de funcionamiento | — | 0 °C to +70 °C (commercial) |
| Lead Free Status / RoHS | — | RoHS non-compliant (per third-party listing) |
| Configuration Method | — | SRAM-based, requires external configuration device (EPC2/EPC8) |
| In-System Programmability | — | Yes (via JTAG or serial interface) |