EPF10K200SBC356-1X vs EPF10K200SBC356-2X 对比

详细并排对比 EPF10K200SBC356-1X 出自 Intel 和 EPF10K200SBC356-2X 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EPF10K200SBC356-1X EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel

EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel

EPF10K200SBC356-1X ⚠ 最后一次采购

规格对比

参数 EPF10K200SBC356-1X EPF10K200SBC356-2X
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 不推荐新设计
库存状态 有库存 有库存
单价(USD) $138.00 $295.00
Family FLEX 10KE FLEX 10K
Series FLEX-10KS FLEX-10KS
Typical System Gates 200,000 —
Maximum System Gates 513,000 —
Logic Elements (LEs) 9,984 —
Logic Array Blocks (LABs) 1,248 1248
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 39,616 —
User I/Os 274 —
Process Technology 0.22 µm CMOS CMOS 0.22 µm
Core Voltage (VCCINT) 2.5 V (2.375 V to 2.625 V) —
I/O Voltage (VCCIO) 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) —
封装 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch 356-LBGA (35x35 mm, 1.27 mm pitch)
Operating Temperature Grade Commercial —
Speed Grade -1 (fastest commercial bin) -2
安装类型 Surface Mount (BGA) Surface Mount
JTAG Support IEEE Std. 1149.1 boundary scan + ISP —
Lead Free / RoHS Yes (per -1X suffix) —
Configuration Mode SRAM-based, ISP via JTAG —
Logic Elements / Cells — 9984
Approximate Gate Count — 200,000
User I/O Count — 274
电源电压 — 2.375 V to 2.625 V (core)
Propagation Delay (typ.) — 0.4 ns
工作温度 — 0 °C to +70 °C (commercial)
Lead Free Status / RoHS — RoHS non-compliant (per third-party listing)
Configuration Method — SRAM-based, requires external configuration device (EPC2/EPC8)
In-System Programmability — Yes (via JTAG or serial interface)

数据手册与资源

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