EPF10K200SRC240-1X vs EPF10K200SRC240-3 Comparación
Comparación detallada lado a lado de EPF10K200SRC240-1X por Intel y EPF10K200SRC240-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K200SRC240-1X | EPF10K200SRC240-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $540,00 | $132,00 |
| Series | FLEX-10KS | FLEX-10KS |
| Family | FLEX 10KS | FLEX 10KE |
| Logic Elements / Cells | 9984 | 9984 |
| Gates | 200,000 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded SRAM (EABs) | 98,304 bits | — |
| Maximum User I/O | 182 | — |
| I/O Banks | 4 | — |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | 2.5 V |
| I/O Voltage (VCCIO) | 5.0 V / 3.3 V / 2.5 V (multi-voltage I/O) | MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant) |
| Speed Grade | -1 (fastest commercial) | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | 0 C to 70 C (Commercial) |
| Process Technology | 0.22 um / 0.3 um CMOS | 0.22 um CMOS |
| Encapsulado | 240-RQFP (32x32 mm, 0.5 mm pitch) | 240-BFQFP Exposed Pad (RQFP-240) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Non-Compliant (legacy FLEX 10KS) | [DATA_NEEDED: RoHS status] |
| Configuration Mode | Serial / Parallel EPROM or JTAG | — |
| Total System Gates | — | 200,000 |
| Total RAM Bits | — | 98,304 |
| Number of LABs/CLBs | — | 1248 |
| Number of I/Os | — | 470 |
| Number of DLLs | — | 4 |
| Package Dimensions | — | 34.60 x 34.6 mm, 0.5 mm pitch |
| Maximum Internal Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.4 ns |