EPF10K200SRC240-1X - 200K Gate FLEX-10KS FPGA, 240-RQFP | Intel
N.º de pieza: EPF10K200SRC240-1X ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $740.86 | $740,86 |
| 10 | $685 | $6.850,00 |
| 100 | $620 | $62.000,00 |
| 500 | $580 | $290.000,00 |
| 1.000 | $540 | $540.000,00 |
EPF10K200SRC240-1X Descripción general
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that an engineer can rewire after manufacturing to implement arbitrary digital circuits. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) between traditional CPLDs (smaller, non-volatile, deterministic timing) and ASICs (custom-silicon performance at high NRE cost). The FLEX 10KS architecture introduced by Altera in the late 1990s was among the first commercial FPGAs to embed dedicated SRAM blocks (EABs/ESBs), making it suitable for data-path, DSP, and memory-intensive glue logic.
Key features of the EPF10K200SRC240-1X include 9,984 logic elements, 1248 Logic Array Blocks (LABs), 98,304 embedded SRAM bits organized into Embedded Array Blocks (EABs), 182 maximum user I/O across 4 I/O banks, and multi-voltage I/O support (5.0 V, 3.3 V, 2.5 V). The device supports in-system configuration via serial or parallel EPROM/Flash, and is pin-compatible within the FLEX 10KS 240-pin RQFP family, enabling SameFrame migration to smaller or larger density parts without PCB rework.
The FLEX 10KS architecture pairs a fine-grained logic fabric with row/column interconnect, an embedded array of SRAM blocks for wide-word memory or lookup-table expansion, and four I/O banks with independent V/CCIO rails for mixed-voltage interfacing. The '-1X' speed grade typically yields internal toggle rates around 250 MHz for simple counter paths, making the device adequate for legacy telecom, industrial control, and bus-bridging applications rather than high-speed SERDES work.
Typical applications include legacy telecom line-card glue logic, industrial PLC backplanes, MIL-STD-1553 / ARINC 429 protocol bridges, parallel bus expansion (ISA, VME, PC/104), and pin-compatible upgrades for designs originally built on EPF10K100 / EPF10K130 / EPF10K200E FLEX 10K family members. The 240-RQFP package is also attractive for hand-solderable prototypes and field-repair scenarios where BGA rework equipment is unavailable.
When designing with this part, verify that the chosen JTAG chain programmer supports the FLEX 10KS family (Quartus II 13.0 or MAX+PLUS II 10.2 are the last fully supported toolchains). For new designs, consider Cyclone IV or MAX II as modern pin-compatible migration targets; for drop-in replacement of an obsolete or EOL FLEX 10KS board, the part is currently available through authorized distributors and franchised brokers.
This page consolidates distributor stock, drop-in same-package alternatives within the FLEX 10KS family, and practical sourcing notes that are not present in the legacy FLEX 10KS datasheet volume.
Alternativas directas para EPF10K200SRC240-1X — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPF10K200SRC240-1X (mismo factor de forma y huella) — difiere en Family, Process Technology, Operating Temperature, Package, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPF10K200SRC240-1N
✅ Sustitución directa✓ En stock
$68.4 / unidad
Ver hoja de datos →EPF10K200SRC240-1
✅ Sustitución directa✓ En stock
$112 / unidad
Ver hoja de datos →EPF10K130EQC240-3N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$19.8 / unidad
Ver hoja de datos →EPF10K100EQC240-3N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$49.95 / unidad
Ver hoja de datos →EPF10K100BQC240-3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$16.95 / unidad
Ver hoja de datos →EPF10K50EQC240-3N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$59.5 / unidad
Ver hoja de datos →EPF10K200SRC240-1X Valores máximos y características eléctricas
| Series | FLEX-10KS |
| Family | FLEX 10KS |
| Logic Elements / Cells | 9984 |
| Gates | 200,000 |
| Logic Array Blocks (LABs) | 1248 |
| Embedded SRAM (EABs) | 98,304 bits |
| Maximum User I/O | 182 |
| I/O Banks | 4 |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | 5.0 V / 3.3 V / 2.5 V (multi-voltage I/O) |
| Speed Grade | -1 (fastest commercial) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Process Technology | 0.22 um / 0.3 um CMOS |
| Encapsulado | 240-RQFP (32x32 mm, 0.5 mm pitch) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Non-Compliant (legacy FLEX 10KS) |
| Configuration Mode | Serial / Parallel EPROM or JTAG |
Guía de configuración de pines de EPF10K200SRC240-1X 240-rqfp (32x32 mm, 0.5 mm pitch)
Configuración de pines para EPF10K200SRC240-1X (encapsulado 240-rqfp (32x32 mm, 0.5 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPF10K200SRC240-1X.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPF10K200SRC240-1X es adecuado para 6 aplicacións: Legacy Telecom Line-Card Glue Logic, Industrial PLC Backplane Bridging, MIL-STD-1553 / ARINC 429 Protocol Bridge, Parallel Bus Expansion (ISA / VME / PC/104), SameFrame Footprint Migration to Lower-Cost Boards, VME / VXS Legacy Card Repair and Field Service.
Legacy Telecom Line-Card Glue Logic
The EPF10K200SRC240-1X fits legacy telecom line-card glue-logic designs because its 9,984 logic elements and 98,304 embedded SRAM bits provide ample capacity to bridge TDM buses, E1/T1 framers, and HDLC controllers without external memory. Its multi-voltage I/O banks (5.0 V / 3.3 V / 2.5 V) interface directly to legacy TTL and CMOS telecom ASICs, eliminating level shifters. The 240-RQFP package is hand-repairable for field-installed cards. Industrial temperature grade (-40C to +85C) covers the central-office environment and outdoor cabinet use. For a new telecom design today, however, consider Cyclone IV or Cyclone V as modern lower-power replacements.
Recomendado
Industrial PLC Backplane Bridging
Industrial PLC backplanes frequently require non-deterministic glue logic to bridge sensor buses, encoder interfaces, and proprietary fieldbus protocols, and the EPF10K200SRC240-1X is a strong fit with 9,984 logic elements and 182 user I/O. The 240-RQFP footprint accepts through-hole-style PCB assemblies still common in long-life industrial control designs, and the industrial temperature range covers harsh factory-floor ambient conditions. Embedded SRAM (EABs) can implement dual-port lookup tables for protocol-stack acceleration. Pair it with the EPF10K130EQC240-1N for backplane redundancy designs requiring lower-cost secondary controllers.
Recomendado
MIL-STD-1553 / ARINC 429 Protocol Bridge
Avionics and military embedded systems still rely on MIL-STD-1553 and ARINC 429 protocol bridges, and the EPF10K200SRC240-1X is well-suited because its 9,984 logic elements can implement dual redundant Manchester encoder/decoders, RT validation, and timing logic without external state machines. The 240-RQFP package is favorable for through-hole PCB layouts typical of legacy avionics LRUs where BGA rework equipment is unavailable. Industrial temperature grade supports the broader avionics thermal envelope; for actual flight-qualified builds, the EPF10K200SFC484-1X in a more thermally robust FineLine BGA-484 is sometimes preferred.
Recomendado
Parallel Bus Expansion (ISA / VME / PC/104)
The EPF10K200SRC240-1X is commonly used as an ISA, VME, or PC/104 bus-master bridge and protocol converter in legacy industrial PCs and test equipment, where its 182 user I/O and four I/O banks with independent VCCIO rails (5 V / 3.3 V / 2.5 V) directly interface to multiple parallel bus standards on the same die. The 240-RQFP package remains attractive for hand-repairable boards in field-deployed test stations. Embedded SRAM blocks (98,304 bits) are sufficient to implement FIFO buffers and lookup tables for bus-arbitration logic, reducing external RAM requirements.
Recomendado
SameFrame Footprint Migration to Lower-Cost Boards
For designs originally built around the EPF10K200SRC240-1X, the 240-RQFP SameFrame pinout allows migration to lower-cost FLEX 10K family members on the same PCB without redesign: EPF10K130EQC240 (13,248 LEs) and EPF10K100EQC240 (10,000 LEs) both share the 240-RQFP footprint. This is the cheapest way to reduce BoM cost on lower-density product variants. Pin compatibility is documented in the FLEX 10KS datasheet SameFrame pin-migration section. Always re-run Quartus II place-and-route and timing analysis after migration to verify the smaller part has enough logic and routing resources for the design.
Recomendado
VME / VXS Legacy Card Repair and Field Service
The EPF10K200SRC240-1X remains in demand for repair of legacy VME and VXS-based defense and aerospace cards where original-equipment replacement requires the exact FLEX 10KS 240-RQFP footprint. Industrial temperature range, the proven 240-RQFP package (which accepts through-hole pin-in-paste rework), and the multi-sourced distributor network (Rochester Electronics, Heisener, Arrow) make the part readily available for field service. The '-1X' speed grade ensures timing-equivalent replacement for cards originally built around the same suffix. For new designs, however, designers should plan a forward migration to Cyclone IV or Cyclone 10 LP families to avoid future obsolescence.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPF10K200SRC240-1X — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPF10K200SRC240-1N | EPF10K200SRC240-1 | EPF10K130EQC240-3N | EPF10K100EQC240-3N | EPF10K50EQC240-3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 240-RQFP (32x32) | 240-RQFP (32x32) - same | 240-RQFP (32x32) - same | 240-RQFP (32x32) - same | 240-RQFP (32x32) - same | 240-RQFP (32x32) - same |
| Logic Elements | 9984 | 9984 | 9984 | 13,248 | 10,000 | 4980 |
| Maximum User I/O | 182 | 182 | 182 | 186 | 186 | 189 |
| Embedded SRAM | 98,304 bits | 98,304 bits | 98,304 bits | 131,072 bits | 94,208 bits | 40,960 bits |
| Speed Grade | -1X (fastest commercial) | -1N (standard) | -1 (standard commercial temp) | -3N (3rd slowest) | -3N (3rd slowest) | -3N (3rd slowest) |
| Operating Temperature Range | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Diferenciadores clave
- Same-frame 240-RQFP pin compatibility across the FLEX 10K/10KS/10KE family (frente a EPF10K200EBC600-2 (BGA-600 package))
- Fastest commercial speed grade in the FLEX 10KS 240-RQFP family (frente a EPF10K200SRC240-1N (standard speed grade))
- Industrial temperature range coverage on the fastest speed grade (frente a EPF10K200SRC240-1 (commercial temp, standard speed))
- 9,984 logic elements vs lower-density same-footprint alternatives (frente a EPF10K100EQC240-3N (10,000 LEs))
Notas de diseño
The EPF10K200SRC240-1X requires a tightly regulated 2.5 V core supply on VCCINT (2.375 V to 2.625 V) plus one or more VCCIO rails (5.0 V / 3.3 V / 2.5 V) for the four I/O banks. Decouple VCCINT and VCCIO separately with bulk 100 uF plus 0.1 uF + 10 uF ceramic networks placed within 5 mm of the package pins; shared inductance between the two rails causes VCCINT droop during simultaneous I/O switching events on the FLEX 10KS family. Estimated: with 9984 logic elements at typical 20% toggle utilization at 50 MHz, dynamic current draw on VCCINT is approximately 200-300 mA.
At 9984 logic elements running near 100% utilization, the EPF10K200SRC240-1X 240-RQFP package dissipates approximately 2-3 W continuous. The 240-RQFP (32x32 mm) has no exposed thermal pad, so heat removal relies on the lead frame and copper pours on the top and bottom PCB layers; ensure at least 4 layer PCB with 1 oz copper on outer layers and unbroken ground planes on inner layers to keep junction temperature below 100C in industrial environments. Forced-air cooling is recommended for high-altitude or sealed enclosures.
Place the configuration EPROM (e.g., EPC2 or EPC4) within 50 mm of the EPF10K200SRC240-1X DATA, DCLK, nCONFIG, and nSTATUS pins to avoid configuration clock skew; route DCLK as a 50 ohm controlled-impedance microstrip trace and avoid splitting its reference plane. For JTAG programming, route TMS, TDI, TDO, TCK into the JTAG chain with TCK buffered only at the chain source. Boundary-scan tests on the FLEX 10KS family require the JTAG pins to be inaccessible to other devices - add series 33 ohm ferrite beads if the JTAG pins are shared with user I/O.
Do not confuse the EPF10K200SRC240-1X (industrial temp, fastest speed grade) with the EPF10K200SRC240-1 (commercial temp, standard speed grade) or the EPF10K200SRC240-1N (industrial temp, standard speed grade). They share the same package, but their timing and temperature specs do not. Also avoid hand-modifying FLEX 10KS JTAG chain order in production PCBs: pin 1 of the 240-RQFP is at the top-left dot marker, and pin numbering is counter-clockwise - reverse-engineered pinout images on the internet are sometimes flipped, so always verify against the FLEX 10KS datasheet pin table before prototype builds.
For LVTTL or LVCMOS 3.3 V outputs on the EPF10K200SRC240-1X, place a 33 ohm series damping resistor within 5 mm of the FPGA pin to control edge rates below 2 V/ns and minimize reflections on traces longer than 50 mm. SSTL or LVDS I/O standards on the FLEX 10KS family are NOT supported - choose LVCMOS or LVTTL only, and ensure the I/O standard for each bank matches the VCCIO voltage (5.0 V bank cannot drive 3.3 V LVTTL reliably). Verify output drive strength in Quartus II pin planner - default 12 mA may need to be reduced to 8 mA for high-density boards.
Información de cumplimiento
FLEX 10KS family (1990s architecture) is generally non-RoHS (lead-bearing) per legacy datasheet compliance information. Reach and conflict-minerals status is compliable per Altera/Intel documentation; AEC-Q100 is not applicable for FPGAs.
