EPF10K20RC240-3N vs EPF10K20RC240-3 Comparación
Comparación detallada lado a lado de EPF10K20RC240-3N por Altera y EPF10K20RC240-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K20RC240-3N | EPF10K20RC240-3 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $23,10 | $21,20 |
| Series | FLEX 10K | FLEX-10K® |
| Family | Embedded Programmable Logic Device (EPLD) | FLEX 10K |
| Logic Cells / Elements | 1152 | — |
| Total Gates | 20,000 (typical usable) | — |
| Logic Capacity (typical) | 12,888 | — |
| Logic Array Blocks (LABs) | 144 | 189 |
| User I/O Pins | 189 | — |
| Embedded Array Blocks (EABs) | 6 (per family architecture) | 6 (2 Kbit each) |
| Número de pines | 240 | — |
| Package Type | 240-RQFP (HFQFP, exposed pad) | — |
| Package Code | HFQFP / RQFP | — |
| Tipo de montaje | Surface Mount (gull wing) | Surface Mount |
| Tensión de alimentación | 5 V | — |
| Technology / Process | 0.42 µm CMOS | — |
| Maximum Internal Frequency | 125 MHz | 125 MHz |
| Propagation Delay | 0.4 ns (typical) | — |
| Speed Grade | -3 | -3 |
| Temperatura de funcionamiento | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (Commercial) |
| Programming Interface | JTAG (IEEE 1149.1), ByteBlaster / MasterBlaster / ByteBlasterMV | — |
| Configuration Memory | SRAM (volatile, re-programmable) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | unknown (legacy Altera part, likely non-RoHS) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Typical Gates | — | 20,000 |
| Logic Elements (LEs) | — | 12,288 |
| Flip-Flops | — | 1,152 |
| Total EAB RAM | — | 12 Kbits |
| User I/Os | — | 470 (max per package) |
| Encapsulado | — | 240-BFQFP Exposed Pad (RQFP-240) |
| Process Technology | — | 0.42 µm CMOS, 5 metal layers |
| Core Supply Voltage (VCCINT) | — | 5 V |
| I/O Supply Voltage (VCCIO) | — | 3.3 V or 5 V tolerant |
| Propagation Delay (tpd) | — | 0.4 ns |
| Configuration Interface | — | JTAG (IEEE 1149.1) + serial configuration PROM |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Programming | — | SRAM-based, in-system reconfigurable |