EPF10K20RC240-4 vs EPF10K20RC240-3 Comparación
Comparación detallada lado a lado de EPF10K20RC240-4 por Intel y EPF10K20RC240-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K20RC240-4 | EPF10K20RC240-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $67,85 | $21,20 |
| Family | FLEX 10K | FLEX 10K |
| Typical Gates | 20,000 | 20,000 |
| Logic Elements / Cells | 1,152 | — |
| Logic Array Blocks (LABs) | 144 | 189 |
| User I/Os | 189 | 470 (max per package) |
| Encapsulado | 240-BFQFP Exposed Pad (RQFP) | 240-BFQFP Exposed Pad (RQFP-240) |
| Recuento de pines | 240 | — |
| Tensión de alimentación | 5 V | — |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS, 5 metal layers |
| Temperatura de funcionamiento | 0 °C to 70 °C | 0 °C to +70 °C (Commercial) |
| Speed Grade | -4 | -3 |
| Propagation Delay | 0.4 ns (per DigChip) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL Level] | [DATA_NEEDED: MSL rating] |
| Estado RoHS | non_compliant (legacy BFQFP, SnPb finish) | unknown (legacy Altera part, likely non-RoHS) |
| Embedded Memory | EAB (Embedded Array Block) SRAM/ROM | — |
| Series | — | FLEX-10K® |
| Logic Elements (LEs) | — | 12,288 |
| Flip-Flops | — | 1,152 |
| Embedded Array Blocks (EABs) | — | 6 (2 Kbit each) |
| Total EAB RAM | — | 12 Kbits |
| Core Supply Voltage (VCCINT) | — | 5 V |
| I/O Supply Voltage (VCCIO) | — | 3.3 V or 5 V tolerant |
| Propagation Delay (tpd) | — | 0.4 ns |
| Maximum Internal Frequency | — | 125 MHz |
| Configuration Interface | — | JTAG (IEEE 1149.1) + serial configuration PROM |
| Programming | — | SRAM-based, in-system reconfigurable |