EPF10K250EBC600-3 vs EPF10K250EBC600-1 Comparación
Comparación detallada lado a lado de EPF10K250EBC600-3 por Intel y EPF10K250EBC600-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K250EBC600-3 | EPF10K250EBC600-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $205,00 | $155,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 LEs | 12,160 |
| Typical Gates | 250,000 | 250,000 |
| Maximum User I/O | 470 | — |
| Embedded Array Blocks (EABs) | 12 (each 2 Kbits) | 6 |
| Total Embedded Memory | 24 Kbits (RAM) | — |
| PLLs (Phase-Locked Loops) | 4 | — |
| Dedicated Clock Inputs | 6 | — |
| Speed Grade | -3 | -1 |
| Core Supply Voltage | 3.3 V | — |
| I/O Supply Voltage | 3.3 V (5 V tolerant) | — |
| Encapsulado | 600-ball FineLine BGA | 600-BGA FineLine BGA |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | 0°C to +70°C (Commercial) |
| Process Technology | SRAM-based CMOS | 0.22 µm SRAM |
| Manufacturer | — | Intel / Altera |
| Usable Gates | — | 110,000 |
| Maximum RAM Bits | — | 40,960 |
| Number of PLLs | — | 6 |
| Core Voltage | — | 5.0 V |
| Configuration Method | — | JTAG / ByteBlaster / EPC-series PROM |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |
| Programmable I/O Voltage | — | 3.3 V / 5.0 V (MultiVolt I/O) |