EPF10K250EFI672-3 vs EPF10K200EFC672-3 Comparación
Comparación detallada lado a lado de EPF10K250EFI672-3 por Intel y EPF10K200EFC672-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoleteComparación de especificaciones
| Parámetro | EPF10K250EFI672-3 | EPF10K200EFC672-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $125,00 | $115,00 |
| Family | FLEX 10KE | — |
| Typical Gates | 250,000 | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| User I/O Pins | 470 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| EAB Dual-Port Width | Up to 16-bit | — |
| Maximum EAB Memory | [DATA_NEEDED: bits per EAB] | — |
| Propagation Delay (tpd) | 0.4 ns (typical, -3 speed grade) | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 2.5 V / 3.3 V (multiVolt I/O) | — |
| Encapsulado | 672-ball FineLine BGA, 1.27 mm pitch | — |
| Process Technology | CMOS, SRAM-based configuration | 0.22 µm CMOS |
| Configuration Interface | JTAG / ByteBlaster (EPC2/EPC8 PROM) | — |
| Temperatura de funcionamiento | 0 °C to 70 °C (commercial) | 0 °C to +70 °C (commercial) |
| Design Entry | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog | — |
| Estado RoHS | Unknown (legacy Altera non-RoHS device) | [DATA_NEEDED: rohs status] |
| Series | — | FLEX 10KE |
| Number of Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1248 |
| Total RAM Bits | — | 98,304 bits (12 EABs of 8 Kbits) |
| Number of I/O | — | 470 |
| Number of Gates (typical) | — | 200,000 |
| Supply Voltage - Operating | — | 2.3 V to 2.7 V (2.5 V nominal) |
| Maximum Operating Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.4 ns |
| Encapsulado / Carcasa | — | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Tipo de montaje | — | Surface Mount |
| Configuration Memory | — | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | — | 4 |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |