EPF10K250EFI672-3 vs EPF10K200EFC672-3 Comparaison
Comparaison détaillée côte à côte de EPF10K250EFI672-3 par Intel et EPF10K200EFC672-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoleteComparaison des spécifications
| Paramètre | EPF10K250EFI672-3 | EPF10K200EFC672-3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $125,00 | $115,00 |
| Family | FLEX 10KE | — |
| Typical Gates | 250,000 | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| User I/O Pins | 470 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| EAB Dual-Port Width | Up to 16-bit | — |
| Maximum EAB Memory | [DATA_NEEDED: bits per EAB] | — |
| Propagation Delay (tpd) | 0.4 ns (typical, -3 speed grade) | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 2.5 V / 3.3 V (multiVolt I/O) | — |
| Boîtier | 672-ball FineLine BGA, 1.27 mm pitch | — |
| Process Technology | CMOS, SRAM-based configuration | 0.22 µm CMOS |
| Configuration Interface | JTAG / ByteBlaster (EPC2/EPC8 PROM) | — |
| Température de fonctionnement | 0 °C to 70 °C (commercial) | 0 °C to +70 °C (commercial) |
| Design Entry | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog | — |
| Statut RoHS | Unknown (legacy Altera non-RoHS device) | [DATA_NEEDED: rohs status] |
| Series | — | FLEX 10KE |
| Number of Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1248 |
| Total RAM Bits | — | 98,304 bits (12 EABs of 8 Kbits) |
| Number of I/O | — | 470 |
| Number of Gates (typical) | — | 200,000 |
| Supply Voltage - Operating | — | 2.3 V to 2.7 V (2.5 V nominal) |
| Maximum Operating Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.4 ns |
| Boîtier / Format | — | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Type de montage | — | Surface Mount |
| Configuration Memory | — | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | — | 4 |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |