EPF10K250EGI599-3 vs EPF10K250EGC599-1 Comparación
Comparación detallada lado a lado de EPF10K250EGI599-3 por Intel y EPF10K250EGC599-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K250EGI599-3 | EPF10K250EGC599-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $162,00 |
| Series | FLEX 10KE | FLEX 10K |
| Family | FLEX 10K Embedded Programmable Logic Device | — |
| Logic Elements (LEs) | 12,160 | — |
| Typical Gates | 250,000 | — |
| Maximum User I/O | 488 | — |
| Embedded Array Blocks (EABs) | 20 | — |
| Total RAM Bits | 40,960 | — |
| Core Voltage | 2.5 V | — |
| Supply Voltage Range | 2.3 V min | — |
| Speed Grade | –3 | — |
| Temperatura de funcionamiento | –40 °C to +85 °C (Industrial) | 0C to +70C (Commercial) |
| Encapsulado | PGA-599 | 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) |
| Tipo de montaje | Through-Hole (PGA) | Through-Hole (PGA) |
| Process Technology | 0.25 µm CMOS, SRAM-based | — |
| Configuration Mode | Passive Serial, Active Serial, JTAG | — |
| Estado RoHS | Non-RoHS Compliant | unknown (ceramic HIPGA package historically non-RoHS) |
| Nivel MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| Product Type | — | FPGA (Field-Programmable Gate Array) |
| Logic Elements | — | 40,960 |
| Equivalent Gates | — | 250,000 |
| Flip-Flops | — | 12,160 |
| User I/O Pins | — | 470 |
| Embedded Array Blocks (EAB) | — | 20 (2 Kbit each) |
| Recuento de pines | — | 599 |
| Configuration | — | SRAM (volatile), serial/parallel EPROM |
| Process Node | — | 0.42 µm CMOS |
| I/O Standard Support | — | 5.0 V PCI, LVTTL, LVCMOS |
| Programming Interface | — | JTAG (IEEE 1149.1), passive serial |