EPF10K30EQC208-1 vs EPF10K30EQC208-2 Comparación
Comparación detallada lado a lado de EPF10K30EQC208-1 por Intel y EPF10K30EQC208-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K30EQC208-1 | EPF10K30EQC208-2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,95 | $17,85 |
| Series | FLEX 10KE | — |
| Family | FLEX 10K | FLEX 10KE |
| Logic Elements / Cells | 1,728 | — |
| Total Gates | 30,000 (typical), 119,000 (maximum) | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Array Blocks (EABs) | 6 (2,048 bits each) | 6 (24 Kbits total) |
| Total RAM Bits | 24,576 | — |
| User I/Os | 147 | — |
| Core Voltage | 2.5 V (2.375 V–2.625 V) | — |
| I/O Voltage | 5.0 V tolerant | — |
| Process Technology | 0.30 µm CMOS SRAM | 0.22 µm CMOS |
| Internal Frequency | 80 MHz (max) | — |
| Encapsulado | 208-BQFP (PQFP) 28×28 mm | 208-pin PQFP (Plastic Quad Flat Pack) |
| Tipo de montaje | Surface Mount (Gull-Wing) | Surface Mount (gull-wing leads) |
| Temperatura de funcionamiento | 0 °C to +70 °C (Commercial) | Commercial (0 °C to +70 °C) |
| Propagation Delay | 0.6 ns (typ) | — |
| Configuration Interface | JTAG (IEEE 1149.1) + Serial (EPC compatible) | — |
| Estado RoHS | Not RoHS compliant (SnPb lead finish on BQFP) | Non-compliant (legacy PQFP package) |
| Logic Elements | — | 1,728 |
| Typical Gates | — | 30,000 |
| Embedded Memory (bits) | — | 24,576 |
| Maximum User I/O | — | 147 |
| Core Supply Voltage | — | 2.5 V |
| Speed Grade | — | -2 |
| Package Dimensions | — | 30.60 mm × 30.60 mm, 0.50 mm pitch |
| Maximum Internal Frequency | — | 200 MHz |
| Programmability | — | SRAM-based, JTAG/ISP |