EPF10K30EQC208-1 vs EPF10K30EQC208-2 Comparaison
Comparaison détaillée côte à côte de EPF10K30EQC208-1 par Intel et EPF10K30EQC208-2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K30EQC208-1 | EPF10K30EQC208-2 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $17,95 | $17,85 |
| Series | FLEX 10KE | — |
| Family | FLEX 10K | FLEX 10KE |
| Logic Elements / Cells | 1,728 | — |
| Total Gates | 30,000 (typical), 119,000 (maximum) | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Array Blocks (EABs) | 6 (2,048 bits each) | 6 (24 Kbits total) |
| Total RAM Bits | 24,576 | — |
| User I/Os | 147 | — |
| Core Voltage | 2.5 V (2.375 V–2.625 V) | — |
| I/O Voltage | 5.0 V tolerant | — |
| Process Technology | 0.30 µm CMOS SRAM | 0.22 µm CMOS |
| Internal Frequency | 80 MHz (max) | — |
| Boîtier | 208-BQFP (PQFP) 28×28 mm | 208-pin PQFP (Plastic Quad Flat Pack) |
| Type de montage | Surface Mount (Gull-Wing) | Surface Mount (gull-wing leads) |
| Température de fonctionnement | 0 °C to +70 °C (Commercial) | Commercial (0 °C to +70 °C) |
| Propagation Delay | 0.6 ns (typ) | — |
| Configuration Interface | JTAG (IEEE 1149.1) + Serial (EPC compatible) | — |
| Statut RoHS | Not RoHS compliant (SnPb lead finish on BQFP) | Non-compliant (legacy PQFP package) |
| Logic Elements | — | 1,728 |
| Typical Gates | — | 30,000 |
| Embedded Memory (bits) | — | 24,576 |
| Maximum User I/O | — | 147 |
| Core Supply Voltage | — | 2.5 V |
| Speed Grade | — | -2 |
| Package Dimensions | — | 30.60 mm × 30.60 mm, 0.50 mm pitch |
| Maximum Internal Frequency | — | 200 MHz |
| Programmability | — | SRAM-based, JTAG/ISP |