EPF10K30ETI144-3 vs EPF10K30ETC144-2 Comparación
Comparación detallada lado a lado de EPF10K30ETI144-3 por Altera y EPF10K30ETC144-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K30ETI144-3 | EPF10K30ETC144-2 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $29,80 | $37,80 |
| Series | FLEX-10KE | FLEX 10KE |
| Family | FLEX-10KE Embedded Programmable Logic Device | FLEX 10KE |
| Logic Elements | 1728 | 1,728 |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded RAM | 24,576 bits | — |
| Embedded Array Blocks (EABs) | 6 | 6 |
| Maximum User I/O | 102 | — |
| Maximum Equivalent Gates | 119,000 | — |
| Pin-to-Pin Delay (Speed Grade) | 12.5 ns | — |
| Supply Voltage (Core) | 2.5 V / 3.3 V | — |
| I/O Voltage Tolerance | 5.0 V / 3.3 V / 2.5 V (multi-volt) | — |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | 0C to +70C (Commercial) |
| Encapsulado | 144-LQFP (LFQFP) | 144-LQFP (TQFP, 20x20 mm) |
| Package Height | 1.6 mm | — |
| Lead Finish | Tin/Lead (Sn/Pb) | — |
| Tipo de montaje | Surface Mount (Gull Wing) | Surface Mount |
| Configuration Method | SRAM (volatile) + JTAG IEEE 1149.1 | SRAM, JTAG (IEEE 1149.1) |
| Estado RoHS | Non-Compliant (Sn/Pb lead finish) | Compliant (lead-free) |
| Typical Gates | — | 30,000 |
| Maximum User I/Os | — | 102 |
| Embedded Memory Bits | — | 24,576 |
| Speed Grade | — | -2 |
| Core Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | — | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Internal Frequency | — | up to 80 MHz |
| Propagation Delay (typ.) | — | 0.6 ns |
| Process Technology | — | CMOS, SRAM-based |