EPF10K30ETI144-3 vs EPF10K30ETC144-2 Comparaison
Comparaison détaillée côte à côte de EPF10K30ETI144-3 par Altera et EPF10K30ETC144-2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K30ETI144-3 | EPF10K30ETC144-2 |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $29,80 | $37,80 |
| Series | FLEX-10KE | FLEX 10KE |
| Family | FLEX-10KE Embedded Programmable Logic Device | FLEX 10KE |
| Logic Elements | 1728 | 1,728 |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded RAM | 24,576 bits | — |
| Embedded Array Blocks (EABs) | 6 | 6 |
| Maximum User I/O | 102 | — |
| Maximum Equivalent Gates | 119,000 | — |
| Pin-to-Pin Delay (Speed Grade) | 12.5 ns | — |
| Supply Voltage (Core) | 2.5 V / 3.3 V | — |
| I/O Voltage Tolerance | 5.0 V / 3.3 V / 2.5 V (multi-volt) | — |
| Température de fonctionnement | -40C to +85C (Industrial) | 0C to +70C (Commercial) |
| Boîtier | 144-LQFP (LFQFP) | 144-LQFP (TQFP, 20x20 mm) |
| Package Height | 1.6 mm | — |
| Lead Finish | Tin/Lead (Sn/Pb) | — |
| Type de montage | Surface Mount (Gull Wing) | Surface Mount |
| Configuration Method | SRAM (volatile) + JTAG IEEE 1149.1 | SRAM, JTAG (IEEE 1149.1) |
| Statut RoHS | Non-Compliant (Sn/Pb lead finish) | Compliant (lead-free) |
| Typical Gates | — | 30,000 |
| Maximum User I/Os | — | 102 |
| Embedded Memory Bits | — | 24,576 |
| Speed Grade | — | -2 |
| Core Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | — | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Internal Frequency | — | up to 80 MHz |
| Propagation Delay (typ.) | — | 0.6 ns |
| Process Technology | — | CMOS, SRAM-based |