EPF10K50SQC208-2 vs EPF10K50EQC208-3 Comparación
Comparación detallada lado a lado de EPF10K50SQC208-2 por Altera y EPF10K50EQC208-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K50SQC208-2 | EPF10K50EQC208-3 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $64,20 | $18,20 |
| Manufacturer | Altera (Intel) | — |
| Series | FLEX-10KS® | — |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Logic Family / Process | CMOS, 0.22 µm SRAM | — |
| Typical Gates | 50,000 gates | — |
| Maximum System Gates | 100,000 gates | — |
| Logic Cells | 2,880 | — |
| Registers / Flip-Flops | 4,096 | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| Embedded Array Blocks (EABs) | 10 | — |
| Embedded Memory | 40,960 bits (40 Kbit) | — |
| User I/Os | 147 | 147 |
| Core Supply Voltage | 2.375 V to 2.625 V (nominal 2.5 V) | 2.3 V to 2.7 V (2.5 V typical) |
| I/O Supply Voltage | 2.5 V / 3.3 V / 5.0 V tolerant (banked VCCIO) | 3.3 V or 5.0 V |
| Encapsulado | 208-BFQFP / 208-PQFP, 28 x 28 mm, gull-wing | 208-BFQFP (PQFP), 28 × 28 mm |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | -2 | — |
| Temperatura de funcionamiento | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Programming Interface | IEEE 1149.1 JTAG / ByteBlaster | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Logic Family (per Vyrian listing) | CMOS | — |
| Family | — | FLEX 10KE (EPF10K50E) |
| Typical Gate Count | — | 50,000 gates |
| Logic Elements | — | 2,880 |
| Embedded Memory (EAB) | — | 40,960 bits |
| Maximum Internal Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.6 ns (per DigChip) |
| Nivel MSL | — | [DATA_NEEDED: MSL Level] |
| Configuration Method | — | SRAM, volatile (requires EPC boot device) |
| Process Technology | — | 0.22 µm CMOS, SRAM-based |
| Estado del ciclo de vida | — | Obsolete (per Rocelec / Altera PCN history) |