EPF10K50SQC208-2 vs EPF10K50EQC208-3 Comparaison
Comparaison détaillée côte à côte de EPF10K50SQC208-2 par Altera et EPF10K50EQC208-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K50SQC208-2 | EPF10K50EQC208-3 |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $64,20 | $18,20 |
| Manufacturer | Altera (Intel) | — |
| Series | FLEX-10KS® | — |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Logic Family / Process | CMOS, 0.22 µm SRAM | — |
| Typical Gates | 50,000 gates | — |
| Maximum System Gates | 100,000 gates | — |
| Logic Cells | 2,880 | — |
| Registers / Flip-Flops | 4,096 | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| Embedded Array Blocks (EABs) | 10 | — |
| Embedded Memory | 40,960 bits (40 Kbit) | — |
| User I/Os | 147 | 147 |
| Core Supply Voltage | 2.375 V to 2.625 V (nominal 2.5 V) | 2.3 V to 2.7 V (2.5 V typical) |
| I/O Supply Voltage | 2.5 V / 3.3 V / 5.0 V tolerant (banked VCCIO) | 3.3 V or 5.0 V |
| Boîtier | 208-BFQFP / 208-PQFP, 28 x 28 mm, gull-wing | 208-BFQFP (PQFP), 28 × 28 mm |
| Type de montage | Surface Mount | Surface Mount |
| Speed Grade | -2 | — |
| Température de fonctionnement | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Programming Interface | IEEE 1149.1 JTAG / ByteBlaster | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Logic Family (per Vyrian listing) | CMOS | — |
| Family | — | FLEX 10KE (EPF10K50E) |
| Typical Gate Count | — | 50,000 gates |
| Logic Elements | — | 2,880 |
| Embedded Memory (EAB) | — | 40,960 bits |
| Maximum Internal Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.6 ns (per DigChip) |
| Niveau MSL | — | [DATA_NEEDED: MSL Level] |
| Configuration Method | — | SRAM, volatile (requires EPC boot device) |
| Process Technology | — | 0.22 µm CMOS, SRAM-based |
| Statut du cycle de vie | — | Obsolete (per Rocelec / Altera PCN history) |