EPF6016AFC256-3 vs EPF6010ATC144-3 Comparación
Comparación detallada lado a lado de EPF6016AFC256-3 por Intel y EPF6010ATC144-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF6016AFC256-3 | EPF6010ATC144-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $22,10 | $9,75 |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | 16K | — |
| Logic Elements (LEs) | 1320 | — |
| Logic Array Blocks (LABs) | 132 | — |
| User I/Os | 171 | — |
| Maximum Internal Frequency | 142.86 MHz | 142.86 MHz |
| Edge Rate | 172 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS SRAM |
| Core Supply Voltage | 3.3 V | — |
| Encapsulado | 256-ball FineLine BGA (FBGA) | — |
| Recuento de pines | 256 | — |
| Speed Grade | -3 | -3 |
| Configuration Method | SRAM (volatile, requires external PROM) | — |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE Std 1149.1) / Serial |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| System Gates | — | 10,000 |
| Logic Elements / Logic Cells | — | 880 |
| Maximum User I/O | — | 102 |
| Supply Voltage - Operating | — | 3.0 V to 3.6 V |
| Configuration Memory | — | SRAM (volatile, re-programmable) |
| I/O Standards | — | LVTTL, LVCMOS, PCI compatible; multiVolt I/O |
| Package Type | — | 144-pin TQFP (Fine Line) |
| Pin Pitch | — | 0.5 mm |
| Operating Temperature Grade | — | Commercial / Industrial |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |