EPF6016AFC256-3 vs EPF6010ATC144-3 Vergleich
Detaillierter Direktvergleich von EPF6016AFC256-3 von Intel und EPF6010ATC144-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF6016AFC256-3 | EPF6010ATC144-3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $22,10 | $9,75 |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | 16K | — |
| Logic Elements (LEs) | 1320 | — |
| Logic Array Blocks (LABs) | 132 | — |
| User I/Os | 171 | — |
| Maximum Internal Frequency | 142.86 MHz | 142.86 MHz |
| Edge Rate | 172 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS SRAM |
| Core Supply Voltage | 3.3 V | — |
| Gehäuse | 256-ball FineLine BGA (FBGA) | — |
| Pin-Anzahl | 256 | — |
| Speed Grade | -3 | -3 |
| Configuration Method | SRAM (volatile, requires external PROM) | — |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE Std 1149.1) / Serial |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| System Gates | — | 10,000 |
| Logic Elements / Logic Cells | — | 880 |
| Maximum User I/O | — | 102 |
| Supply Voltage - Operating | — | 3.0 V to 3.6 V |
| Configuration Memory | — | SRAM (volatile, re-programmable) |
| I/O Standards | — | LVTTL, LVCMOS, PCI compatible; multiVolt I/O |
| Package Type | — | 144-pin TQFP (Fine Line) |
| Pin Pitch | — | 0.5 mm |
| Operating Temperature Grade | — | Commercial / Industrial |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |