EPF6016BC256-2 vs EPF6016AFC256-3 Comparación
Comparación detallada lado a lado de EPF6016BC256-2 por Altera y EPF6016AFC256-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF6016BC256-2 | EPF6016AFC256-3 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,85 | $22,10 |
| Family | FLEX 6000 | FLEX 6000 |
| Logic Elements | 1320 | — |
| Typical Gates | 16,000 | — |
| Maximum Logic Gates | 24,000 | — |
| User I/O Pins | 204 | — |
| Supply Voltage (VCCINT / VCCIO) | 4.75 V to 5.25 V | — |
| Encapsulado | 256-FBGA (FineLine BGA, 17x17 mm) | 256-ball FineLine BGA (FBGA) |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | 0 °C to +85 °C (commercial) |
| Speed Grade | -2 | -3 |
| Process Technology | 0.42 um SRAM | 0.42 µm CMOS |
| Programmability | SRAM-based, in-system reconfigurable | — |
| Configuration Interface | JTAG (IEEE 1149.1) + serial | — |
| Internal Memory | Embedded array blocks (EABs) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | — | 16K |
| Logic Elements (LEs) | — | 1320 |
| Logic Array Blocks (LABs) | — | 132 |
| User I/Os | — | 171 |
| Maximum Internal Frequency | — | 142.86 MHz |
| Edge Rate | — | 172 MHz |
| Core Supply Voltage | — | 3.3 V |
| Recuento de pines | — | 256 |
| Configuration Method | — | SRAM (volatile, requires external PROM) |
| Programming Interface | — | JTAG (IEEE 1149.1) |