EPM1270F256C5N vs EPM2210GF324C5 Comparación
Comparación detallada lado a lado de EPM1270F256C5N por Altera y EPM2210GF324C5 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
EPM2210GF324C5 ⚠ Última compraComparación de especificaciones
| Parámetro | EPM1270F256C5N | EPM2210GF324C5 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16,20 | $13,60 |
| Series | MAX II | — |
| Family | EPM1270 | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Number of Macrocells | 980 | — |
| Number of Logic Elements | 1270 | — |
| Number of User I/O | 212 | — |
| Propagation Delay (tPD) | 6.2 ns | — |
| Maximum Frequency (fMAX) | 201.1 MHz | — |
| Supply Voltage - Internal | 2.5 V / 3.3 V | — |
| Temperatura de funcionamiento | 0°C to 85°C (TJ) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Encapsulado / Carcasa | 256-FBGA (256-BGA) | — |
| Supplier Device Package | 256-FBGA | — |
| Process Technology | 0.18 µm | 6-layer-metal flash, 0.18 um |
| Programmable Type | Non-volatile flash, in-system programmable | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | — |
| Estado RoHS | Details (per distributor product page) | Compliant (lead-free) |
| Device Name | — | EPM2210 |
| Logic Elements (LE) | — | 2,210 |
| Equivalent Macrocells | — | 1,700 |
| Maximum User I/Os | — | 272 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | — | 5 ns (C5 speed grade) |
| Internal Performance | — | 304 MHz |
| Core Voltage (VCCINT) | — | 1.8 V |
| I/O Voltage (VCCIO) - MultiVolt | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Temperatura de unión de funcionamiento | — | 0C to +85C (commercial) |
| Encapsulado | — | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm |
| In-System Programmability | — | JTAG (IEEE 1149.1) |