EPM2210F256C4 vs EPM2210F256C3N Comparación
Comparación detallada lado a lado de EPM2210F256C4 por Altera y EPM2210F256C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM2210F256C4 | EPM2210F256C3N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $42,80 | $47,10 |
| Series | MAX II | MAX II |
| Logic Elements | 2,210 | — |
| Equivalent Macrocells | 1,700 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| User I/O Pins | 212 | — |
| Encapsulado | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 um flash CMOS |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltage (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Pin-to-pin Delay (tPD1) | 7 ns | — |
| Maximum Frequency (fMAX) | 201 MHz | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial extended) | — |
| Programming Interface | JTAG (IEEE 1149.1) ISP | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant (per DigiKey product page) |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Programmable Type | — | In System Programmable (JTAG, IEEE 1149.1) |
| Macrocells | — | 1700 |
| Logic Elements / Blocks | — | 2210 |
| Number of User I/Os | — | 204 |
| Maximum Propagation Delay (tPD) | — | 7 ns |
| Maximum Internal Frequency (fMAX) | — | 304 MHz |
| Internal Supply Voltage | — | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) |
| I/O Standard Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) |
| User Flash Memory | — | 8 Kbits |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Temperatura de unión de funcionamiento | — | 0 C to 85 C (commercial, TJ suffix 'C') |
| Nivel MSL | — | 3 (per JEDEC J-STD-020, typical for FBGA) |