EPM2210F256C4 vs EPM2210F256C4N Comparación
Comparación detallada lado a lado de EPM2210F256C4 por Altera y EPM2210F256C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM2210F256C4 | EPM2210F256C4N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $42,80 | $39,85 |
| Series | MAX II | — |
| Logic Elements | 2,210 | — |
| Equivalent Macrocells | 1,700 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| User I/O Pins | 212 | — |
| Encapsulado | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA) |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 µm |
| Core Supply Voltage | 1.8 V | 3.0 V to 3.6 V (3.3 V typical) |
| I/O Supply Voltage (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Pin-to-pin Delay (tPD1) | 7 ns | — |
| Maximum Frequency (fMAX) | 201 MHz | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial extended) | — |
| Programming Interface | JTAG (IEEE 1149.1) ISP | JTAG IEEE Std. 1149.1 + ISP |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Family | — | MAX II |
| Device Type | — | CPLD |
| Logic Elements (LE) | — | 2210 |
| Macro Cells | — | 1700 |
| User Flash Memory | — | 204 Kbit |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Propagation Delay (tPD) | — | 7.0 ns |
| Maximum User I/O Pins | — | 212 (varies with package) |
| Global Clock Networks | — | 4 |
| MultiVolt I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz |
| Rango de temperatura de funcionamiento | — | 0 °C to +85 °C (Commercial) |
| Lead-Free | — | Yes |