EPM2210F256C4N vs EPM2210F256C4 Comparación
Comparación detallada lado a lado de EPM2210F256C4N por Intel y EPM2210F256C4 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM2210F256C4N | EPM2210F256C4 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $39,85 | $42,80 |
| Family | MAX II | — |
| Device Type | CPLD | — |
| Logic Elements (LE) | 2210 | — |
| Macro Cells | 1700 | — |
| User Flash Memory | 204 Kbit | — |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns | — |
| Maximum User I/O Pins | 212 (varies with package) | — |
| Global Clock Networks | 4 | — |
| Process Technology | 0.18 µm | 0.18 µm 6-layer-metal flash |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) | 1.8 V |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz | — |
| Rango de temperatura de funcionamiento | 0 °C to +85 °C (Commercial) | — |
| Encapsulado | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA) |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP | JTAG (IEEE 1149.1) ISP |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | MAX II |
| Logic Elements | — | 2,210 |
| Equivalent Macrocells | — | 1,700 |
| User Flash Memory (UFM) | — | 8 Kbits |
| User I/O Pins | — | 212 |
| I/O Supply Voltage (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Pin-to-pin Delay (tPD1) | — | 7 ns |
| Maximum Frequency (fMAX) | — | 201 MHz |
| Temperatura de funcionamiento | — | 0 °C to +85 °C (commercial extended) |