EPM2210GF324C4N vs EPM2210F324C3N Comparación
Comparación detallada lado a lado de EPM2210GF324C4N por Intel y EPM2210F324C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM2210GF324C4N | EPM2210F324C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,60 | $65,20 |
| Family | MAX II | — |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1,700 |
| User I/Os (max) | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Logic Delay (tPD) | 7.0 ns (C4 speed grade) | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 6-layer-metal CMOS, flash-based |
| Encapsulado | 324-ball FineLine BGA (GF324) | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | JTAG 1149.1 (in-system programmable, ISP) |
| Operating Temperature (commercial) | 0 °C to +85 °C | — |
| Estado RoHS | Compliant | Lead-free (per datasheet) |
| Device Family | — | MAX II |
| Logic Elements (LE) | — | 2,210 |
| Maximum User I/Os | — | 272 |
| Pin-to-Pin Delay (tPD1) | — | 7 ns (commercial speed grade) |
| Global Clock Networks | — | 4 |
| Core Voltage | — | 1.8 V |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Design Software | — | Quartus II / Quartus Prime (Intel FPGA) |