EPM2210GF324C4N vs EPM2210F324C3N Vergleich
Detaillierter Direktvergleich von EPM2210GF324C4N von Intel und EPM2210F324C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM2210GF324C4N | EPM2210F324C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $25,60 | $65,20 |
| Family | MAX II | — |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1,700 |
| User I/Os (max) | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Logic Delay (tPD) | 7.0 ns (C4 speed grade) | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 6-layer-metal CMOS, flash-based |
| Gehäuse | 324-ball FineLine BGA (GF324) | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | JTAG 1149.1 (in-system programmable, ISP) |
| Operating Temperature (commercial) | 0 °C to +85 °C | — |
| RoHS-Status | Compliant | Lead-free (per datasheet) |
| Device Family | — | MAX II |
| Logic Elements (LE) | — | 2,210 |
| Maximum User I/Os | — | 272 |
| Pin-to-Pin Delay (tPD1) | — | 7 ns (commercial speed grade) |
| Global Clock Networks | — | 4 |
| Core Voltage | — | 1.8 V |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Design Software | — | Quartus II / Quartus Prime (Intel FPGA) |