EPM570GF256C5N vs EPM2210GF256C5N Comparación
Comparación detallada lado a lado de EPM570GF256C5N por Intel y EPM2210GF256C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570GF256C5N | EPM2210GF256C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,95 | $11,20 |
| Device Family | MAX II | — |
| Logic Elements | 570 | 2210 |
| Macrocells | 440 | — |
| Maximum User I/Os | 212 | — |
| Pin-to-Pin Delay (tPD) | 5.4 ns | — |
| Maximum Frequency (fMAX) | 304 MHz | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Operating Voltage (VCCINT) | 3.3 V | — |
| I/O Voltage Support (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Encapsulado | 256-ball FineLine BGA (17 x 17 mm, 1.0 mm pitch) | 256-ball FineLine BGA (GF256) |
| Process Technology | 0.18 µm Flash-based CMOS | — |
| Configuration Method | Non-volatile, instant-on (Flash) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | — |
| Temperatura de funcionamiento | -40 °C to +125 °C (Industrial) | — |
| Lead-Free / RoHS | Yes (Lead-free finish) | — |
| Family | — | MAX II |
| Speed Grade | — | C5 |
| Temperature Grade | — | Commercial (N) |
| Process Node | — | 0.18 µm |
| Configuration Memory | — | Non-volatile on-chip Flash |
| Maximum User I/O Pins | — | 272 |
| User Flash Memory | — | 8 Kbits |
| On-chip Oscillator | — | Yes |
| Multi-volt I/O Support | — | 1.5V / 1.8V / 2.5V / 3.3V |
| Programmable Interconnect | — | MultiTrack |
| In-system Programming | — | JTAG (IEEE 1149.1) |
| Logic Block Architecture | — | 4-input LUT |
| Tipo de montaje | — | Surface Mount (BGA) |
| Estado RoHS | — | [DATA_NEEDED: rohs status] |