EPM570GM256I5N vs EPM570M256C5N Comparación
Comparación detallada lado a lado de EPM570GM256I5N por Intel y EPM570M256C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570GM256I5N | EPM570M256C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,40 | $19,45 |
| Device Family | MAX II | — |
| Series | MAX II G | EPM570 |
| Logic Elements (LE) | 570 | — |
| Macrocells | 440 | — |
| User I/Os | 160 | — |
| Propagation Delay (tpd) | 5.4 ns (max) | — |
| Internal Supply Voltage | 1.71 V to 1.89 V | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Programmable Type | In-System Programmable (ISP) | — |
| Temperatura de funcionamiento | -40 C to +100 C (TJ, industrial) | 0°C to +85°C (commercial) |
| Package Type | 256-TFBGA (MBGA), 11x11 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | — |
| JTAG / Boundary Scan | IEEE 1149.1 compliant | — |
| Process Technology | 6-layer-metal flash CMOS | 0.18 µm CMOS, non-volatile Flash |
| Family | — | MAX II |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | — | 440 |
| Macro Cells | — | 440 |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| Maximum Operating Frequency | — | 201.1 MHz |
| Supply Voltage - Core | — | 1.8 V |
| Supply Voltage - I/O Banks | — | 2.5 V / 3.3 V |
| User I/O Pins | — | 212 (max, package-limited) |
| User Flash Memory | — | 8 Kbits |
| Encapsulado | — | 256-MBGA (Micro FineLine BGA), 1.0 mm pitch |
| Configuration Interface | — | JTAG (IEEE 1149.1) / in-system programmable |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |