EPM570M100C5N vs EPM570ZM100I8N Comparación
Comparación detallada lado a lado de EPM570M100C5N por Intel y EPM570ZM100I8N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570M100C5N | EPM570ZM100I8N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11,85 | $16,50 |
| Family | MAX II | — |
| Series | EPM570 | EPM570Z |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Macrocell Count | 440 | — |
| Logic Elements | 570 | 570 |
| User I/Os | 76 | 76 |
| Number of Logic Blocks / Array Blocks | [DATA_NEEDED: number of LABs] | — |
| Número de pines | 100 | — |
| Encapsulado | 100-MBGA (FineLine BGA, 6 x 6 mm, 0.5 mm pitch) | — |
| Maximum Frequency (fMAX) | 201.1 MHz | — |
| Pin-to-Pin Propagation Delay | 5.4 ns | — |
| Operating Supply Voltage (Core) | 2.5 V / 3.3 V | 1.8 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| On-Chip User Flash Memory (UFM) | 8 Kbits | — |
| Process Technology | 0.18 um, 6-layer-metal flash | — |
| Programming Interface | JTAG (IEEE 1149.1) and ISP | — |
| Rango de temperatura de funcionamiento | 0 C to +85 C (Commercial) | -40 C to +85 C (Industrial) |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Lead-Free / Compliant | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Device Family | — | MAX II |
| Number of Macrocells | — | 440 |
| Number of Logic Array Blocks (LABs) | — | 57 |
| Maximum Operating Frequency | — | 152 MHz |
| Propagation Delay (tPD) | — | 9 ns |
| Programming Technology | — | Flash, non-volatile |
| In-System Programmability (ISP) | — | Yes (JTAG) |
| Boundary Scan | — | IEEE 1149.1 (JTAG) |
| Estilo de montaje | — | SMD/SMT |
| Encapsulado / Carcasa | — | 100-ball FineLine BGA (MBGA, 0.8 mm pitch) |
| Packaging | — | Tray |