EPM570M256C4N vs EPM570GF256C5N Comparación
Comparación detallada lado a lado de EPM570M256C4N por Intel y EPM570GF256C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570M256C4N | EPM570GF256C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,31 | $17,95 |
| Family | MAX II | — |
| Device Logic Elements | 440 LE | — |
| Macro Cells | 440 | — |
| Maximum User I/Os | 160 | 212 |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbits |
| Internal Performance (fMAX) | 247.5 MHz | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V | — |
| Process Technology | 0.18 µm CMOS | 0.18 µm Flash-based CMOS |
| Configuration Memory | On-chip Flash (non-volatile, instant-on ≤ 0.5 ms) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP |
| Encapsulado | 256-ball Micro FineLine BGA (MBGA), 11 × 11 mm | 256-ball FineLine BGA (17 x 17 mm, 1.0 mm pitch) |
| Tipo de montaje | Surface Mount (BGA) | — |
| Temperatura de funcionamiento | -40 °C to +125 °C | -40 °C to +125 °C (Industrial) |
| Lead-Free / RoHS | Yes, LEAD FREE (per datasheet.com spec listing) | Yes (Lead-free finish) |
| Logic Family | CMOS | — |
| Device Family | — | MAX II |
| Logic Elements | — | 570 |
| Macrocells | — | 440 |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| Maximum Frequency (fMAX) | — | 304 MHz |
| Operating Voltage (VCCINT) | — | 3.3 V |
| I/O Voltage Support (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Method | — | Non-volatile, instant-on (Flash) |