EPM570M256C4N vs EPM570GM256C5N Comparación
Comparación detallada lado a lado de EPM570M256C4N por Intel y EPM570GM256C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570M256C4N | EPM570GM256C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,31 | $18,60 |
| Family | MAX II | CPLD - Complex Programmable Logic Device |
| Device Logic Elements | 440 LE | — |
| Macro Cells | 440 | 440 |
| Maximum User I/Os | 160 | — |
| User Flash Memory (UFM) | 8 Kbit | — |
| Internal Performance (fMAX) | 247.5 MHz | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V | — |
| Process Technology | 0.18 µm CMOS | 0.18 um flash-based CMOS |
| Configuration Memory | On-chip Flash (non-volatile, instant-on ≤ 0.5 ms) | Internal flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | — |
| Encapsulado | 256-ball Micro FineLine BGA (MBGA), 11 × 11 mm | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Temperatura de funcionamiento | -40 °C to +125 °C | 0 °C to +85 °C (commercial) |
| Lead-Free / RoHS | Yes, LEAD FREE (per datasheet.com spec listing) | — |
| Logic Family | CMOS | — |
| Series | — | MAX II |
| Logic Array Blocks (LABs) | — | 57 |
| Number of I/Os | — | 160 |
| Maximum Operating Frequency | — | 304 MHz |
| Maximum Internal Frequency (datasheet fMAX) | — | 201.1 MHz |
| Pin-to-Pin Logic Delay (Speed Grade C5) | — | 5 ns |
| Operating Supply Voltage (Core VCCINT) | — | 1.71 V to 1.89 V (1.8 V nominal) |
| I/O Bank Supply Voltages | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) |
| Programmable Type | — | In System Programmable (ISP) via JTAG |
| Encapsulado / Carcasa | — | 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch |
| Estilo de montaje | — | SMD/SMT |
| Packaging | — | Tray |
| Lead Free / RoHS Status | — | See manufacturer page; legacy part - verify per lot |
| JTAG Support | — | Yes (IEEE 1149.1 / 1532) |
| Vertical Migration | — | Pin-compatible with EPM1270 and EPM2210 in the 256-MBGA package |